Method of forming metal interconnection on thick polyimide film
View Patent ↗Many current micromachining devices are integrated with materials such as very thick layer of polyimide (10 to 100 um) to offer essential characteristics and properties for various applications; it is inherently difficult and complicated to provide reliable metal interconnections between different levels of the circuits. The present invention is generally related to a novel micromachining process and structure to form metal interconnections in integrated circuits or micromachining devices which are incorporated with thick polyimide films. More particularly, the embodiments of the current invention relates to formation of multi-step staircase structure with tapered angle on polyimide layer, which is therefore capable of offering superb and reliable step coverage for metallization among different levels of integrated circuits, and especially for very thick polyimide layer applications.
1. In a substrate having a polyimide layer overlying on an substrate with an existing integrated circuit, wherein the polyimide layer having another integrated circuit on its top surface, a method of forming a multi-step staircase structure with each step tapered on the polyimide layer for metal interconnection between said two integrated circuits comprising of the following steps:
disposing a layer of photoresist;
applying a first photo mask to expose the photoresist with UV light and then be developed to form a photoresist pattern;
a preliminary baking process on the photoresist pattern with the substrate in an convection oven at 90° C. for 30 to 50 minutes;
a secondary baking process on the photoresist pattern with substrate in an convection oven at 110° C. for 30 to 50 minutes;
applying an inductively coupled reactive ion etching of oxygen plasma to the polyimide layer using photoresist pattern as an etching mask;
stripping the photoresist; and
repeating above process with corresponding photo masks to form multi-step staircase structure by etching other tapered steps in the thickness direction until undesired portion of the polyimide layer on the substrate is completely etched, and the integrated circuit on the substrate is exposed.
2. The method of claim 1 wherein:
number of steps on the multi-step staircase on the polyimide layer is depended on thickness of the polyimide layer and photoresist; the etching selectivity between polyimide and photoresist is about 1 to 1; wherein in the case of 30 um thick of polymide with a photoresist thickness of 10 um thick for each etching, the polyimide will need three times of etching to form the multi-step staircase structure with three tapered steps; or wherein
with a photoresist is thickness of 15 um for each etching, the polyimide will only need twice of etching to form the multi-step staircase structure with two tapered steps.
3. The method of claim 1 wherein:
the preliminary baking process in a lower temperature is applied to prevent feature size of the photoresist pattern changed, during the following the secondary baking step.
4. The method of claim 1 wherein:
the secondary baking step is applied to reflow the photoresist to gain a gradual slope on photoresist edge profile.
5. The method of claim 1 wherein:
the inductively coupled reactive ion etching of oxygen plasma is generated under coil power of 600 Watt with oxygen flow of 40 sccm at 30 mtorr of chamber pressure; in order to reduce roughness of etched surface, platen power to enhance ion bombardment has to be turned off.