IP Library Granted Patent US 8,007,288
Granted Patent B2
US 8,007,288 · App. 12/566,923 · Granted Aug 30, 2011

Apparatus for connecting a multi-conductor cable to a pin grid array connector

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Quick Facts
Patent No.
US 8,007,288
App. No.
12/566,923
Granted
Aug 30, 2011
Kind
B2
Abstract

An apparatus for connecting a multi-conductor cable of a first device to a pin grid array connector of a second device, wherein said apparatus comprises a first printed circuit board (PCB) for terminating the conductors of the cable, which are connected to a first PCB surface mounted connector mounted on the first PCB. The first PCB surface mounted connector is mated with a second PCB surface mounted connector mounted on a second PCB, on which a PCB surface mounted socket grid array is also mounted for mating to the pin grid array connector of the second device. This apparatus allows the same (i.e., standardized) multi-conductor cable with the same first PCB and the same first PCB surface mounted connector to be used regardless of what style connector is used by the second device.

Claims (15)

1. An apparatus for connecting a multi-conductor cable to a pin grid array connector comprising:

a first printed circuit board comprising a first plurality of circuits connected to a plurality of conductors from said multi-conductor cable;

a first printed circuit board surface mounted connector mounted to said first printed circuit board, wherein said first printed circuit board surface mounted connector comprises a first plurality of electrical contacts connected to said first plurality of circuits and said plurality of conductors from said multi-conductor cable via said first plurality of circuits;

a second printed circuit board comprising a second plurality of circuits;

a second printed circuit board surface mounted connector mounted to said second printed circuit board and mated to said first printed circuit board surface mounted connector, wherein said second printed circuit board surface mounted connector comprises a second plurality of electrical contacts mated to said first plurality of electrical contacts and connected to said second plurality of circuits; and

a printed circuit board surface mounted socket grid array mounted to said second printed circuit board for mating to said pin grid array connector, wherein said printed circuit board surface mounted socket grid array comprises a plurality of sockets connected to said second plurality of circuits and said second plurality of electrical contacts via said second plurality of circuits.

2. The apparatus of claim 1 , wherein said first plurality of circuits are connected to said plurality of conductors from said multi-conductor cable by soldering said plurality of conductors to said first plurality of circuits.

3. The apparatus of claim 1 , wherein said second plurality of circuits are connected to said plurality of sockets by soldering said plurality of sockets to said second plurality of circuits.

4. The apparatus of claim 3 further comprising epoxy between said printed circuit board surface mounted socket grid array and second printed circuit board.

5. The apparatus of claim 1 further comprising:

a housing; and

a support device fixed to said housing and positioned adjacent to and coupled with said first printed circuit board surface mounted connector.

6. The apparatus of claim 5 further comprising a pad between said support device and said first printed circuit board surface mounted connector.

7. The apparatus of claim 5 , wherein said support device is a clamp or a bracket.

8. The apparatus of claim 1 , wherein said first printed circuit board surface mounted connector and said second printed circuit board surface mounted connector are low profile style connectors.

Assignments (3)
CHANGE OF ADDRESS DECLARATION Recorded Apr 16, 2026
From: WAYGATE TECHNOLOGIES USA LP
To: WAYGATE TECHNOLOGIES USA, LP
Reel/Frame 075422/0111 →
CHANGE OF NAME Recorded Dec 1, 2021
From: GE INSPECTION TECHNOLOGIES, LP
To: WAYGATE TECHNOLOGIES USA, LP
Reel/Frame 058292/0450 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2009
From: YETTER, KELLEY E.; DESAI, ANAND; PYLE, JOHN; CHOI, JAE
To: GE INSPECTION TECHNOLOGIES, LP.
Reel/Frame 023284/0589 →