Electronic device and manufacturing method thereof
View Patent ↗An electronic device includes: a package including a lid and a package base, the package being formed by bonding the lid to a joint surface of the package base using a bonding material; and a resin portion covering the package. The resin portion covers at least the package base and the bonding material, and at least a part of the resin portion has a section outline. The section outline has an outermost portion thereof in a direction parallel with a mount surface of the electronic device. The outermost portion is located below a lower surface of the lid in a direction perpendicular to the mount surface of the electronic device.
1. An electronic device comprising:
a package including a lid and a package base, the package being formed by bonding the lid to a joint surface of the package base using a bonding material; and
a resin portion covering the package, wherein:
the resin portion covers at least the package base and the bonding material; at least a part of the resin portion has a section outline; the section outline has an outermost portion thereof in a direction parallel with a mount surface of the electronic device; and the outermost portion is located below a lower surface of the lid in a direction perpendicular to the mount surface of the electronic device.
2. The electronic device according to claim 1 , wherein
the outermost portion is located below the joint surface of the package base in the direction perpendicular to the mount surface of the electronic device.
3. The electronic device according to claim 1 , wherein
the section outline has a sagging portion linking an upper end of the outermost portion and a surface of the lid, and the sagging portion is formed in the form of a fillet.
4. The electronic device according to claim 1 , wherein
the section outline has a sagging portion linking an upper end of the outermost portion and a surface of the lid, and the sagging portion is formed in the form of a chamfer.
5. The electronic device according to claim 1 , wherein:
the package is a piezoelectric resonator containing a piezoelectric resonator element; a circuit substrate including a circuit element is coupled to a mount electrode provided on a lower surface of the package via a conductive coupling member; and the resin portion covers the circuit element and the coupling member.