IP Library Granted Patent US 8,313,167
Granted Patent B2
US 8,313,167 · App. 12/568,739 · Granted Nov 20, 2012

Tiled manifold for a page wide printhead

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Quick Facts
Patent No.
US 8,313,167
App. No.
12/568,739
Granted
Nov 20, 2012
Kind
B2
Abstract

An ink manifold constructed with a number of semiconductor tiles which are fastened end to end on a rigid base member to form a page wide print mechanism. Each tile is constructed with ink channels on one side in liquid communication with ink outlet ports on the opposite side. The ink channels carry ink from ports in the base member to the outlet ports of the tiles. The interface between each tile defines a boundary. An inkjet printhead is fastened over each boundary of the tiled manifold so that the ink inlet ports of the printhead are aligned with the ink outlet ports of the underlying tiles. No ink passes across the boundary of the adjacent manifold tiles. The fabrication of the individual tiles from a semiconductor wafer facilitates usage of the wafer when fabricating page wide print mechanisms.

Claims (18)

1. A micro-fluidic ejector device, comprising:

a plurality of ejector heads for depositing fluid on a medium;

a plurality of tiles forming a tiled manifold for carrying a liquid from a liquid source to the plurality of ejector heads;

the tiles of the manifold arranged together to span a substantial width of the medium; and

said ejector heads fastened to the tiled manifold to form an integral unit, wherein the tiles of said tiled manifold each include an elongate channel, where the same elongate channel supplies a liquid to a respective inlet port of two offset ejector heads.

2. The micro-fluidic ejector device of claim 1 wherein ones of said manifold tiles are identically made.

3. The micro-fluidic ejector device of claim 1 wherein each said manifold tile is arranged adjacent to a neighbor manifold tile to define a boundary therebetween, and wherein each said ejector head overlies a respective said boundary.

4. The micro-fluidic ejector device of claim 3 wherein the boundary of said neighbor manifold tiles is located between inlet ports of said overlying ejector head.

5. The micro-fluidic ejector device of claim 1 wherein the tiles of said tiled manifold each include an elongate channel formed on one side thereof, and include a port formed on an opposite side thereof, where said channel is in fluidic communication with said port.

6. The micro-fluidic ejector device of claim 1 wherein said tiled manifold is constructed of a semiconductor material.

7. A micro-fluidic ejector device, comprising:

a plurality of ejector heads for depositing fluid on a medium;

a plurality of tiles forming a tiled manifold for carrying a liquid from a liquid source to the plurality of ejector heads;

the tiles of the manifold arranged together to span a substantial width of the medium;

said ejector heads fastened to the tiled manifold to form an integral unit;

a base member to which said tiled manifold is fastened, said base member coupling a liquid from one or more liquid reservoirs to said tiled manifold, wherein said base member is constructed with outlet ports, and said tiled manifold is constructed with channels, and when said tiled manifold is fastened to said base member, the ports of said base member are in fluid communication with respective channels of said tiled manifold and each outlet port of said base member is wider than a respective channel of said tiled manifold to thereby allow some misalignment of said tiled manifold with respect to said base member.

8. The micro-fluidic ejector device of claim 7 wherein said base member is constructed of a ceramic material.

9. The micro-fluidic ejector device of claim 7 wherein said tiled manifold includes outlet ports adapted for coupling to a printhead, and the outlet ports of said tiled manifold are coupled to respective channels of said tiled manifold, and wherein said outlet ports of said tiled manifold are wider than corresponding inlet ports of said ejector head to thereby allow some misalignment of said ejector head on said tiled manifold.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2025
From: FUNAI ELECTRIC CO., LTD.
To: BRADY WORLDWIDE, INC.
Reel/Frame 070724/0238 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2013
From: LEXMARK INTERNATIONAL, INC.; LEXMARK INTERNATIONAL TECHNOLOGY, S.A.
To: FUNAI ELECTRIC CO., LTD
Reel/Frame 030416/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2009
From: ANDERSON, FRANK EDWARD; CORLEY, RICHARD EARL, JR.; DIXON, MICHAEL JOHN
To: LEXMARK INTERNATIONAL, INC.
Reel/Frame 023295/0655 →