IP Library Granted Patent US 7,888,844
Granted Patent B2
US 7,888,844 · App. 12/570,298 · Granted Feb 15, 2011

Temperature control of micromachined transducers

Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
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Quick Facts
Patent No.
US 7,888,844
App. No.
12/570,298
Granted
Feb 15, 2011
Kind
B2
Abstract

A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.

Claims (22)

1. A micromachined structure, comprising:

a substrate having a first coefficient of thermal expansion;

a cavity in the substrate; and

a membrane layer having a second coefficient of thermal expansion and disposed over the substrate and spanning the cavity, wherein the first coefficient of thermal expansion is substantially identical to the second coefficient of thermal expansion; and

an annular resonator disposed over the membrane and comprising a first electrode, a second electrode and a piezoelectric layer between the first and second electrodes.

2. A micromachined structure as claimed in claim 1 , wherein the membrane layer has a thickness that is greater than a combined thickness of the first electrode, the second electrode and the piezoelectric layer.

3. A micromachined structure as claimed in claim 1 , wherein the membrane layer comprises borosilicate glass (BSG).

4. A micromachined structure as claimed in claim 1 , wherein the cavity spans a first width and is provided in a surface of the substrate, and the micromachined structure further comprises an opening in the substrate that spans a second width in an opposing surface of the substrate.

5. A micromachined structure as claimed in claim 1 , wherein the membrane layer is provided over a surface of the substrate, and the substrate comprises an opposing surface, and the micromachined structure further comprises a vent between the cavity and the surface of the substrate.

6. A micromachined structure as claimed in claim 4 , wherein the opening is disposed on tandem with the cavity.

7. A micromachined structure as claimed in claim 1 , wherein the membrane layer comprises one of: polysilicon (poly-Si), or silicon nitride (Si 3 N 4 ) or silicon carbide (SiC), or monocrystalline silicon.

8. A micromachined structure as claimed in claim 2 , wherein the first and second electrodes of the annular resonator are substantially circular.

9. A micromachined structure as claimed in claim 2 , wherein the first and second electrodes of the annular resonator are substantially square.

10. A piezoelectric micromachined transducer (PMT) array, comprising:

a substrate;

a plurality of PMTs arranged over the substrate, each of the PMTs comprising:

a cavity in the substrate;

membrane layer disposed over the substrate and spanning the cavity;

an annular resonator disposed over the membrane and comprising a first electrode, a second electrode and a piezoelectric layer between the first and second electrodes.

11. A PMT array as claimed in claim 10 , wherein cavity of at least one of the PMTs spans a first width and is provided in a surface of the substrate, and the at least one PMT further comprises an opening in the substrate that spans a second width in an opposing surface of the substrate.

12. A PMT array as claimed in claim 10 , wherein the membrane layer of at least one of the PMTs is provided over a surface of the substrate, and the substrate comprises an opposing surface, and the at least one PMT further comprises a vent between the cavity and the surface of the substrate.

13. A PMT array as claimed in claim 12 , wherein the membrane layer comprises borosilicate glass (BSG).

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF THE MERGER PREVIOUSLY RECORDED ON REEL 047642 FRAME 0417. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT, Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048521/0395 →
MERGER Recorded Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047642/0417 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0703 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2009
From: MARTIN, DAVID; LEE, DONALD; CHOY, JOHN; PHILLIBER, JOEL; BUCCAFUSCA, OSVALDO
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 023310/0402 →
Continuity (2)
Continuation In Part 12495443 · Jun 30, 2009
Related Publication 20100327702A1 · Dec 30, 2010