IP Library Granted Patent US 8,287,185
Granted Patent B2
US 8,287,185 · App. 12/571,926 · Granted Oct 16, 2012

Cell temperature sensing apparatus for a battery module

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Quick Facts
Patent No.
US 8,287,185
App. No.
12/571,926
Granted
Oct 16, 2012
Kind
B2
Abstract

A printed circuit board supported over the top surface of a multi-cell battery module for battery cell voltage and temperature monitoring has an array of openings in alignment with selected battery cells for receiving temperature-sensing units that electrically couple with contacts formed on the printed circuit board and resiliently engage the cases of the selected battery cells. Each such temperature-sensing unit includes a printed circuit board mountable lamp socket and a lamp socket insert including a thermistor and a compressible element that maintains the thermistor in thermal proximity to the battery cell case when the temperature-sensing unit is installed in a respective printed circuit board opening.

Claims (21)

1. A cell temperature sensing apparatus for a battery module including at least one battery cell, the apparatus comprising:

a planar circuit board supported on the battery module over a case of the battery cell, the circuit board including an opening in alignment with a temperature sensing location on the case of the battery cell and a set of electrical contacts surrounding said opening; and

a temperature-sensing unit received in the opening for sensing a temperature of the battery cell, including a socket mechanically locked to said circuit board and an insert extending between a base of said socket and the temperature sensing location on the case of the battery cell, said insert including a thermistor element in thermal proximity to said temperature sensing location, a compressible member compressed between said socket and the case of said battery cell to resiliently retain the thermistor element in thermal proximity to said temperature sensing location, and conductors electrically coupling said thermistor element to terminals formed in said socket and coupled to said electrical contacts surrounding said opening.

2. The cell temperature sensing apparatus of claim 1 , wherein

said thermistor element is a radial thermistor with wire leads extending between said thermistor element and said socket; and

said compressible member is a compressible sleeve having a first end that is seated in said socket, a second end that supports said radial thermistor, and a central axial opening in which the wire leads of said thermistor element are received.

3. The cell temperature sensing apparatus of claim 2 , wherein

said socket is a neo-wedge-base lamp socket; and

the wire leads of said thermistor element are wrapped around the base of said socket and engage the electrical contacts surrounding the opening of said circuit board.

4. The cell temperature sensing apparatus of claim 1 , wherein

the thermistor element of said insert is over-molded with a compressible material to form said compressible member.

5. The cell temperature sensing apparatus of claim 4 , wherein

said socket is a wedge-base lamp socket; and

said compressible member is molded in the shape of a wedge-base lamp so as to be retained in the base of said socket.

6. The cell temperature sensing apparatus of claim 4 , wherein

said thermistor element is a surface-mount thermistor; and

said insert additionally includes a flexible circuit that is partially over-molded with said compressible material, said flexible circuit having a first end on which said thermistor element is mounted, and a second end that extends out of said compressible member to engage electrical contacts in the base of said socket.

7. The cell temperature sensing apparatus of claim 6 , wherein

the electrical contacts in the base of said socket are electrically coupled to the electrical contacts surrounding the opening of said circuit board.

8. The cell temperature sensing apparatus of claim 6 , wherein

said surface-mount thermistor is separated from said temperature sensing location on the case of the battery cell by a thin layer of said compressible material and a substrate of said flexible circuit.

Assignments (3)
CHANGE OF NAME Recorded Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068985/0968 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2018
From: DELPHI TECHNOLOGIES, INC.
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 045127/0546 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 1, 2009
From: PULLIAM, TIMOTHY N.; HAWES, KEVIN J.; BEER, ROBERT C.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 023315/0261 →