Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation
View Patent ↗A laminate leadless carrier package comprising an optoelectronic chip, a substrate supporting the chip, the substrate comprising a plurality of conductive and dielectric layers; a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate; an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate, wherein the encapsulation is a molding compound; and wherein the package is arranged to be mounted as a side-looker. A process for manufacturing laminate leadless carrier packages, comprising preparing a substrate; applying epoxy adhesive to a die attach pad; mounting an optoelectronic chip on the die attach pad; wire-bonding the optoelectronic chip; molding a molding compound to form an encapsulation covering the optoelectronic chip, a wire bond, and the top surface of the substrate; and dicing the substrate into individual packages.
1. A laminate leadless carrier package comprising:
an optoelectronic chip;
a substrate supporting the optoelectronic chip, the substrate comprising a plurality of conductive and dielectric layers laminated together including a bottom conductive layer, a top conductive layer, and a dielectric layer between the top and bottom conductive layers;
a plurality of conductive slotted vias providing electrical connections between the top conductive layer and the bottom conductive layer;
a wire bond pad positioned on the top surface of the substrate;
a wire bond coupled to the optoelectronic chip and the wire bond pad;
an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate, wherein the encapsulation is a molding compound; and
wherein the laminate leadless carrier package is arranged to be mounted in a side-looker configuration on a printed circuit board, wherein the active area of the optoelectronic chip is perpendicular to the printed circuit board, and the slotted vias are arranged to be in electrical contact with the brinted circuit board.
2. The laminate leadless carrier package of claim 1 , wherein the optoelectronic chip is supported by the substrate without a lead-frame.
3. The laminate leadless carrier package of claim 1 , wherein the top conductive layer includes a die attach pad, and wherein the optoelectronic chip is adhered to the die attach pad.
4. The laminate leadless carrier package of claim 1 , wherein the wire bond pad is a portion of the top conductive layer.
5. The laminate leadless carrier package of claim 1 , wherein the molding compound has low ionic content.
6. The laminate leadless carrier package of claim 1 , wherein the molding compound has high moisture resistance.
7. The laminate leadless carrier package of claim 1 , wherein the molding compound is optically transparent.
8. The laminate leadless carrier package of claim 1 , wherein the molding compound filters light at particular wavelengths.
9. The laminate leadless carrier package of claim 1 , wherein the encapsulation provides protection without putting high stress to the wire bond.
10. The laminate leadless carrier package of claim 1 , wherein the encapsulation covers the entire top surface of the substrate.
11. The laminate leadless carrier package of claim 1 , wherein the top surface of the encapsulation is molded as a flat surface.
12. The laminate leadless carrier package of claim 1 , wherein the top surface of the encapsulation is molded as a lens.
13. The laminate leadless carrier package of claim 12 , wherein the lens is selected from the group consisting of a cylindrical lens, a spherical lens, a torroidal lens, an aspherical lens, and a dome-shaped lens.
14. The laminate leadless carrier package of claim 1 , wherein the encapsulation further comprises a footing for stabilizing the optoelectronic package when mounted as a side-looker.
15. The laminate leadless carrier package of claim 1 , wherein the optoelectronic chip is selected from the group consisting of a laser, a light-emitting-diode (LED), a photodiode, a phototransistor, a PIN photodiode, an avalanche photodiode (APD), and a silicon photomultiplier (SiPM).
16. The laminate leadless carrier package of claim 1 , wherein the substrate is selected from the group consisting of thin film ceramic substrates, thick film ceramic substrates, and printed circuit boards.
17. The laminate leadless carrier package of claim 1 , further comprising an optical filter covered by the encapsulation, wherein the optical filter is positioned above the active area of the optoelectronic chip.
18. A laminate leadless carrier package comprising:
an optoelectronic chip;
a substrate supporting the optoelectronic chip, the substrate comprising a plurality of conductive and dielectric layers laminated together;
a wire bond pad positioned on the top surface of the substrate;
a wire bond coupled to the optoelectronic chip and the wire bond pad; and
an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate, wherein the encapsulation is a molding compound;
wherein the laminate leadless carrier package is arranged to be mounted in a sidelooker configuration on a printed circuit board, the active area of the optoelectronic chip is perpendicular to the printed circuit board, and in a top-looker configuration on a printed circuit board, and the active area of the optoelectronic chip is parallel to the printed circuit board.