Method of manufacturing a semiconductor device
View Patent ↗A method of manufacturing a semiconductor device which includes forming a gate insulating film and a gate electrode over a semiconductor substrate, forming a first recess in the first semiconductor substrate on both sides of the gate electrode by dry etching, forming a second recess by removing a bottom and sidewalls of the first recess by wet etching, and forming a semiconductor layer in the second recess.
1. A method of manufacturing a semiconductor device, comprising:
forming a gate insulating film over a first semiconductor layer;
forming a gate electrode over the gate insulating film;
forming an insulating film over the first semiconductor layer and the gate electrode;
etching the insulating film and exposing the first semiconductor layer to form a sidewall spacer on the sidewall of the gate electrode;
etching the first semiconductor layer to form a first recess in the first semiconductor layer on both sides of the gate electrode by dry etching using the gate electrode and the sidewall spacer as masks;
forming a second recess by removing a bottom and sidewalls of the first semiconductor layer in the first recess by wet etching; and
forming a second semiconductor layer in the second recess;
wherein the wet etching is performed using an etchant containing an oxidizing agent for oxidizing the first semiconductor layer and an inorganic alkali;
wherein forming the second semiconductor layer is performed by epitaxially growing the second semiconductor layer at a temperature of 450° C. to 600° C.
2. The method of manufacturing a semiconductor device according to claim 1 , wherein the oxidizing agent is hydrogen peroxide and the inorganic alkali is ammonia.
3. The method of manufacturing a semiconductor device according to claim 1 , wherein an etching damage layer formed at the bottom and the sidewall of the first recess is removed by the wet etching.
4. The method of manufacturing a semiconductor device according to claim 1 , wherein an etching amount of the bottom and the sidewall of the first recess by the wet etching is 5 nm to 10 nm.
5. The method of manufacturing a semiconductor device according to claim 1 , further comprising:
removing Si oxide formed at a bottom and sidewalls of the second recess using a solution, after forming the second recess and before forming the second semiconductor layer.
6. The method of manufacturing a semiconductor device according to claim 5 , wherein the solution contains fluorinated acid.
7. The method of manufacturing a semiconductor device according to claim 1 , wherein the second semiconductor layer has a second lattice constant different from a first lattice constant of the first semiconductor layer.