Semiconductor laser device and method of manufacturing the same
View Patent ↗A method of manufacturing semiconductor laser device capable of reducing κL, with manufacturing restrictions satisfied, is provided. In a distributed-feedback or distributed-reflective semiconductor laser device, immediately before burying regrowth of a diffraction grating, halogen-based gas is introduced to a reactor, and etching is performed on the diffraction grating so that each side wall has at least two or more crystal faces and a ratio of length of an upper side in a waveguide direction to a bottom side parallel to a (100) surface is 0 to 0.3. And, a reactive product formed on side surfaces of the diffraction grating and in trench portions between stripes of the diffraction grating at an increase of temperature for regrowth is removed. Therefore, the diffraction grating with reduced height and a sine wave shape is obtained, thereby κL of the device is reduced. Thus, an oscillation threshold and optical output efficiency can be improved.
1. A method of manufacturing semiconductor laser device comprising:
a first step of laminating a first clad layer, an active layer, and a diffraction grating layer on a semiconductor substrate through epitaxial growth;
a second step of forming a diffraction grating by etching the diffraction grating layer; and
a third step of performing burying regrowth of the diffraction grating through epitaxial growth on a second clad layer of different conduction type from the first clad layer,
wherein immediately before the third step, halogen-based gas is introduced to a reactor, and etching is performed on the diffraction grating so that each side wall has at least two or more crystal faces and a ratio of length of an upper side in a waveguide direction to a bottom side parallel to a (100) surface is 0 to 0.3, and a reactive product formed on side surfaces of the diffraction grating and in trench portions between stripes of the diffraction grating at an increase in temperature for regrowth is removed.
2. The method of manufacturing semiconductor laser device according to claim 1 ,
wherein in the first step, a first optical guide layer is further formed between the first clad layer and the active layer, and a second optical guide layer and a spacer layer are formed between the active layer and the diffraction grating layer.
3. The method of manufacturing semiconductor laser device according to claim 1 ,
wherein the diffraction grating layer is a III-V family compound semiconductor layer including at least one of In, Ga, As, and P elements.