Package for electronic component, piezoelectric device and manufacturing method thereof
View Patent ↗A package for an electronic component includes a first substrate and a second substrate. In the package, an interior space capable of housing the electronic component is formed between the first substrate and the second substrate, a sealing hole communicating with the interior space and an exterior is formed in at least one of the first substrate and the second substrate, the interior space can be airtightly sealed by melting a solid sealant provided in the sealing hole, and an interior wall of the sealing hole has a curved surface extending in directions of penetration and inner periphery of the sealing hole.
1. A package for an electronic component, comprising:
a first substrate;
a second substrate coupled to the first substrate so as to form an interior space capable of housing the electronic component between the first and second substrates;
a sealing hole communicating with the interior space and an exterior space formed in at least one of the first substrate and the second substrate, the interior space is airtightly sealable by melting a solid sealant provided in the sealing hole; and
an interior wall of the sealing hole has a curved surface extending in a penetration direction and an inner periphery direction of the sealing hole so that the interior wall has a hemispherical shape,
wherein a base circumference of the hemispherical shaped interior wall faces toward the exterior space.
2. A package for an electronic component, comprising:
a first substrate;
a second substrate coupled to the first substrate so as to form, an interior space capable of housing the electronic component between the first and second substrates;
a sealing hole communicating with the interior space and an exterior space formed in at least one of the first substrate and the second substrate, the interior space is airtightly sealable by providing a sealant in the sealing, hole; and
an interior wall of the sealing hole has a curved surface extending in a penetration direction and an inner periphery direction of the sealing hole so that the interior wall has a hemispherical shape,
wherein the sealing hole has a first opening at an exterior space side of the sealing hole and a second opening at an interior space side of the sealing hole when the sealing hole is plan-viewed from the exterior space toward the interior space, an area of the first opening is greater than an area of the second opening, and a center of the first opening is different from a center of the second opening.
3. A piezoelectric device, comprising:
a piezoelectric resonator element;
a first substrate;
a second substrate coupled to the first substrate so as to form an interior space capable of housing the piezoelectric resonator element between the first and second substrates;
a sealing hole communicating with the interior space and an exterior space formed in at least one of the first substrate and the second substrate; and
a solid sealant provided in the sealing hole by being melted and solidified so as to airtightly seal the interior space,
wherein an interior wall of the sealing hole has a curved surface extending in a penetration direction and an inner periphery direction of the sealing hole so that the interior wall has a hemispherical shape, and
the sealing hole has a first opening at an exterior space side of the sealing hole and a second opening at an interior space side of the sealing hole when the sealing hole is plan-viewed from the exterior space toward the interior space, and an area of the first opening is greater than an area of the second opening.
4. The piezoelectric device according to claim 3 , wherein the second opening of the sealing hole at the interior space side is an oval if the opening is plan-viewed.
5. The piezoelectric device according to claim 3 , wherein a center of the first opening at the exterior side of the sealing hole is different from a center of the second opening at the interior space side.