IP Library Patent Application 12574948
Patent Application
App. No. 12/574,948

ALUMINUM ALLOY SUBSTRATE AND A METHOD OF MANUFACTURING THE SAME

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Quick Facts
Patent No.
US None
App. No.
12/574,948
Abstract

An aluminum alloy substrate having nano-holes in an ordered arrangement is disclosed, as well as a method of manufacturing such an aluminum alloy substrate. The aluminum alloy substrate of the invention includes a substrate, a first underlayer, a second underlayer, and an aluminum-containing layer including a lower layer portion composed of an amorphous aluminum alloy and an amorphous surface layer portion containing alumina, the surface layer portion having a plurality of nano-holes formed thereon.

Claims (11)

1 . An aluminum alloy substrate comprising:

a substrate;

a first underlayer;

a second underlayer; and

an aluminum-containing layer including a lower layer portion composed of an amorphous aluminum alloy and an amorphous surface layer portion containing alumina, the surface layer portion having a plurality of nano-holes formed thereon.

2 . The aluminum alloy substrate according to claim 1 , wherein the aluminum alloy is selected from the group consisting of an Al—Mo alloy, an Al—Ta alloy, an Al—Ti alloy, and an Al—W alloy.

3 . A method of manufacturing an aluminum alloy substrate comprising:

a step of successively forming a first underlayer and a second underlayer on a substrate;

a step of forming an aluminum-containing layer composed of an amorphous aluminum alloy on the second underlayer; and

a step of oxidizing the aluminum-containing layer to form an amorphous alumina-containing layer having a plurality of nano-holes formed in a surface layer portion of the aluminum-containing layer.

4 . The method of manufacturing an aluminum alloy substrate according to claim 3 , wherein the aluminum alloy is selected from the group consisting of an Al—Mo alloy, an Al—Ta alloy, an Al—Ti alloy, and an Al—W alloy.

Assignments (3)
CHANGE OF NAME Recorded Oct 10, 2011
From: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 027249/0159 →
MERGER Recorded Oct 10, 2011
From: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD. (MERGER)
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 027288/0820 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2009
From: NAKATA, HITOSHI
To: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
Reel/Frame 023683/0094 →