IP Library Granted Patent US 8,785,967
Granted Patent B2
US 8,785,967 · App. 12/575,347 · Granted Jul 22, 2014

Local crystallization by heat treatment

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Quick Facts
Patent No.
US 8,785,967
App. No.
12/575,347
Granted
Jul 22, 2014
Kind
B2
Abstract

Disclosed is a crystallization apparatus capable of locally crystallizing amorphous silicon. The crystallization apparatus includes a heat emission part, a support part and a roller. The heat emission part emits heat upon receiving a heat emission source. The support part supports the heat emission part and provides the heat emission source to the heat emission part. The roller receives the heat emission part and has at least one opening to provide heat to a target (e.g., amorphous silicon). Local crystallization is performed without causing damage to a substrate.

Claims (19)

1. An apparatus comprising:

a crystallization apparatus for crystallizing a semiconductor layer, the crystallization apparatus having:

a roller;

at least one heat emission part that is provided at an outer surface of the roller and is configured to receive external electric power so as to emit heat, each heat emission part being sized to correspond to the semiconductor layer of a thin film transistor;

an electrical network arranged in a cylindrical configuration, the electrical network including a first power line and a second power line connected to a separate power source from the first power line to provide the external electric power to the heat emission part.

2. An apparatus comprising:

a crystallization apparatus for crystallizing a semiconductor layer, the crystallization apparatus having:

at least one heat emission part configured to emit heat;

an electrical network arranged in a cylindrical configuration, the electrical network including a first power line and a second power line connected to a separate power source from the first power line;

a support part that supports the heat emission part; and

a roller that receives the heat emission part and comprises at least one opening that is aligned with the heat emission part and that is sized to correspond to the semiconductor layer of a thin film transistor,

wherein the heat emission part is connected between the first power line and the second power line to receive power from the first power line and the second power line.

3. The crystallization apparatus of claim 2 , wherein the first power line and the second power line are disposed on an outer surface of the support part.

4. The crystallization apparatus of claim 3 , wherein the heat emission part comprises a protruding tip comprising two ends that are connected to the first power line and the second power line, respectively.

5. The crystallization apparatus of claim 4 , wherein the protruding tip is aligned with the opening to emit heat through the opening.

6. The crystallization apparatus of claim 4 , wherein the heat emission part comprises one of tungsten, nickel-chrome, and platinum.

7. The crystallization apparatus of claim 2 , wherein the heat emission part comprises a lamp and the lamp is configured to receive electric power from the first power line and the second power line so as to emit a pulsed laser beam.

8. The crystallization apparatus of claim 7 , wherein the heat emission part protrudes from the outer surface of the roller and is shaped into a circle, an ellipse or a polygon.

9. The crystallization apparatus of claim 8 , wherein the heat emission part comprises one of tungsten, nickel-chrome, and platinum.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029008/0876 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 023341 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT CO-ASSIGNEES ARE SAMSUNG ELECTRONICS CO., LTD. AND INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY. Recorded Aug 25, 2011
From: HWANG, TAE-HYUNG; KIM, HYUN-JAE; KIM, DOH-KYUNG; JUNG, TAE-HUN; JEONG, WOONG-HEE; LEE, CHOONG-HEE
To: SAMSUNG ELECTRONICS CO., LTD.; INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
Reel/Frame 026811/0119 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2009
From: HWANG, TAE-HYUNG; KIM, HYUN-JAE; KIM, DOH-KYUNG; JUNG, TAE-HUN; JEONG, WOONG-HEE; LEE, CHOONG-HEE
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 023341/0145 →