IP Library Granted Patent US 8,881,967
Granted Patent B2
US 8,881,967 · App. 12/576,715 · Granted Nov 11, 2014

Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assembly

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Quick Facts
Patent No.
US 8,881,967
App. No.
12/576,715
Granted
Nov 11, 2014
Kind
B2
Abstract

An apparatus for interconnecting two connection pads in a head-gimbal assembly. The apparatus includes a conveyer for conveying a metallic slug, and a nozzle for ejecting the metallic slug toward the two connection pads. The nozzle includes a receiving portion for receiving the metallic slug from the conveyer, and a straight guide disposed downstream of the receiving portion. The straight guide has a maximum inner diameter that is smaller than a minimum inner diameter of the receiving portion. The apparatus also includes a laser for applying a laser beam from an inlet side of the nozzle to the metallic slug as the metallic slug passes along a path that includes a first portion through said straight guide and a second portion between the straight guide and the two connection pads. The laser is configured to melt the metallic slug for attaching the metallic slug to the two connection pads.

Claims (21)

1. An apparatus for interconnecting two connection pads in a head-gimbal assembly, comprising:

a conveyer for conveying a metallic slug;

a nozzle for ejecting said metallic slug toward said two connection pads, said nozzle comprising:

a receiving portion for receiving said metallic slug from said conveyer;

a gas release opening through a sidewall of said nozzle for enabling gas to escape said nozzle; and

a straight guide, said straight guide disposed downstream of said receiving portion, and said straight guide having a maximum inner diameter such that said maximum inner diameter is smaller than a minimum inner diameter of said receiving portion, wherein without requiring an inner diameter of said straight guide to be greater than an outer diameter of said metal slug; and

a laser for applying a laser beam from an inlet side of said nozzle to said metallic slug as said metallic slug passes along a path that comprises a first portion through said straight guide and a second portion between said straight guide and said two connection pads, said laser configured to melt said metallic slug for attaching said molten metallic slug to said two connection pads.

2. The apparatus of claim 1 , wherein said laser is configured to apply said laser beam to said metallic slug while said metallic slug is passing through said straight guide.

3. The apparatus of claim 1 , further comprising:

an optical sensor for detecting said metallic slug;

wherein said laser is configured to apply said laser beam to said metallic slug in response to detection of said metallic slug by said optical sensor.

4. The apparatus of claim 3 , wherein said optical sensor is configured to detect said metallic slug inside said nozzle.

5. The apparatus of claim 4 , wherein said nozzle further comprises:

a flat surface in an area which is configured to receive light for detecting said metallic slug by said optical sensor.

6. The apparatus of claim 1 , wherein said nozzle further comprises:

a gas release hole, other than an orifice for ejection of said metallic slug, in a side surface; and wherein said conveyer is configured to convey said metallic slug to said nozzle with gas flow.

7. The apparatus of claim 6 , wherein said gas release hole is disposed upstream from an inlet to said straight guide.

8. The apparatus of claim 1 , wherein said straight guide is formed at an end portion of said nozzle and an outlet of said straight guide comprises an orifice of said nozzle.

9. The apparatus of claim 1 , wherein said laser is configured to start applying said laser beam after said metallic slug has entered said straight guide.

10. The apparatus of claim 1 , wherein said metallic slug comprises a metal ball, and a cross-section of said straight guide is circular and said inner diameter of said straight guide is greater than or equal to a diameter of said metallic slug.

11. The apparatus of claim 10 , wherein said laser is configured to provide said laser beam with a minimum diameter that is larger than said inner diameter of said straight guide.

Assignments (7)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
SECURITY INTEREST Recorded Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040826/0821 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2009
From: MATSUMOTO, YUHSUKE; TSUCHIYA, TATSUMI; OOSAWA, EIKI; YOSHIDA, TATSUSHI
To: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
Reel/Frame 023353/0559 →