IP Library Granted Patent US 8,883,297
Granted Patent B2
US 8,883,297 · App. 12/577,131 · Granted Nov 11, 2014

Methods for bonding porous flexible membranes using solvent

Inventors: Suresh Kumar Surapalan Nair (Fremont, CA); Majid Keshavarz (Pleasanton, CA); Saroj Kumar Sahu (Mountain House, CA)
Assignee: Imergy Power Systems, Inc.
B01D65/003B01D2313/04H01M8/188Y02E60/528
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Quick Facts
Patent No.
US 8,883,297
App. No.
12/577,131
Granted
Nov 11, 2014
Kind
B2
Abstract

A method for bonding a porous flexible membrane to a rigid material is disclosed. In some embodiments, the method includes applying, at a bonding site of the porous membrane, a pre-treatment solvent solution, drying the bonding site of the porous membrane, applying, at a bonding site of the rigid structure, a first solvent that is capable of dissolving a surface of the rigid material, applying, at the bonding site of the porous membrane, a second solvent that is capable of dissolving the polymeric residue material dissolved in the pre-treatment solvent solution, and pressing the porous membrane to the rigid material at their respective bonding sites. In some embodiments, the pre-treatment solvent solution may include a solvent carrying dissolved polymeric residue material configured to fill the pores of the porous membrane at the bonding site of the porous membrane.

Claims (18)

1. A method of preparing a membrane for a flow cell battery comprising:

bonding a membrane to a frame, wherein the membrane is bonded to the frame by the process comprising:

applying, at a bonding site of the membrane, a pre-treatment solvent solution, the pre-treatment solvent solution comprising a first solvent carrying dissolved polymeric residue material, the dissolved polymeric residue material being configured to fill pores of the membrane at the bonding site of the membrane and to render the bonding site of the membrane to be hydrophobic;

drying the bonding site of the membrane;

wetting the membrane to cause the membrane to expand, the membrane not expanding at the hydrophobic bonding site of the membrane;

applying, at a bonding site of the frame, a second solvent that dissolves a surface layer of the frame;

applying, at the bonding site of the membrane, a third solvent that dissolves the polymeric residue material dissolved in the pre-treatment solvent solution; and

pressing the bonding site of the membrane to the bonding site of the frame at their respective bonding sites,

wherein the membrane is configured for use in a flow cell battery.

2. The method of claim 1 , wherein the membrane is comprised of polyolefin.

3. The method of claim 2 , wherein the membrane is filled with silicon dioxide particles.

4. The method of claim 1 , wherein the membrane is a porous membrane.

5. The method of claim 1 , wherein the membrane is an ion selective membrane.

6. The method of claim 1 , wherein the frame is comprised of polyvinyl chloride or poly methyl methacrylate.

7. The method of claim 1 , wherein the first solvent is comprised of at least one of acetone, N, N-dimethylformamide (DMF), methyl ethyl ketone (MEK), and tetrahydrofuran (THF).

8. The method of claim 1 , wherein the second solvent is comprised of at least one of acetone, N, N-dimethylformamide (DMF), methyl ethyl ketone (MEK), and tetrahydrofuran (THF).

9. The method of claim 1 , wherein the third solvent is comprised of at least one of acetone, N, N-dimethylformamide (DMF), methyl ethyl ketone (MEK), and tetrahydrofuran (THF).

10. The method of claim 1 , wherein the membrane is pressed to the frame with a pressure of 10-50 PSI (69-340 kPa).

Assignments (9)
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NO. 8551299 PREVIOUSLY RECORDED AT REEL: 034172 FRAME: 0948. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE BY SECURED PARTY. Recorded Jun 10, 2016
From: SILICON VALLEY BANK
To: IMERGY POWER SYSTEMS, INC. (FORMERLY KNOWN AS DEEYA ENERGY, INC.)
Reel/Frame 038950/0114 →
RELEASE OF SECURITY INTEREST Recorded Nov 14, 2014
From: SILICON VALLEY BANK
To: IMERGY POWER SYSTEMS, INC. (FORMERLY KNOWN AS DEEYA ENERGY, INC.)
Reel/Frame 034172/0948 →
CHANGE OF NAME Recorded Oct 3, 2014
From: DEEYA ENERGY, INC.
To: IMERGY POWER SYSTEMS, INC.
Reel/Frame 033890/0469 →
SECURITY INTEREST Recorded Jul 19, 2013
From: DEEYA ENERGY, INC.
To: SILLICON VALLEY BANK
Reel/Frame 030871/0539 →
RELEASE OF SECURITY INTEREST Recorded May 29, 2012
From: SILICON VALLEY BANK
To: DEEYA ENERGY, INC.
Reel/Frame 028314/0741 →
RELEASE OF SECURITY INTEREST Recorded Nov 21, 2011
From: TRIPLEPOINT CAPITAL LLC
To: DEEYA ENERGY, INC.
Reel/Frame 027260/0730 →
SECURITY AGREEMENT Recorded Nov 18, 2011
From: DEEYA ENERGY, INC.
To: SILICON VALLEY BANK
Reel/Frame 027256/0148 →
SECURITY AGREEMENT Recorded Aug 24, 2010
From: DEEYA ENERGY, INC.
To: TRIPLEPOINT CAPITAL LLC (AS GRANTEE)
Reel/Frame 024880/0804 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2010
From: NAIR, SURESH KUMAR SURAPALAN; KESHAVARZ, MAJID; SAHU, SAROJ KUMAR
To: DEEYA ENERGY, INC.
Reel/Frame 024234/0403 →
Continuity (2)
Provisional Application 61104611 · Oct 10, 2008
Related Publication 20100092757A1 · Apr 15, 2010