IP Library Granted Patent US 8,780,031
Granted Patent B2
US 8,780,031 · App. 12/578,055 · Granted Jul 15, 2014

Multi-functional integrated circuit and source driver having the same

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Quick Facts
Patent No.
US 8,780,031
App. No.
12/578,055
Granted
Jul 15, 2014
Kind
B2
Abstract

Disclosed are a multi-functional integrated circuit and a source driver having the same. The integrated circuit (IC) chip includes: a first high-voltage transistor configured to precharge a storage node in response to a first control signal; a decoding unit configured to decode a plurality of input signals to output the decoded signal to the storage node; and a second high-voltage transistor configured to transfer an output of the decoding unit to the storage node in response to a second control signal.

Claims (39)

1. An integrated circuit (IC) chip, comprising:

a first high-voltage transistor configured to precharge a storage node in response to a first control signal;

a capacitor coupled to the storage node;

a decoding unit configured to decode a plurality of input signals and to output the decoded signal to the storage node; and

a second high-voltage transistor configured to transfer an output of the decoding unit to the storage node in response to a second control signal, wherein

the decoding unit includes a plurality of low-voltage transistors coupled between a first supply voltage terminal and the second high-voltage transistor in series.

2. The IC chip of claim 1 , wherein the capacitor includes a parasitic capacitor.

3. The IC chip of claim 1 , further comprising a buffer configured to output a signal at the storage node to outside.

4. The IC chip of claim 3 , wherein the buffer includes high-voltage transistors.

5. The IC chip of claim 1 , wherein the low-voltage transistors includes NMOS transistors whose gates receive the input signals.

6. The IC chip of claim 1 , wherein the first high-voltage transistor includes a high-voltage PMOS transistor having a source-drain path connected between a second supply voltage terminal and the storage node, and a gate receiving the first control signal.

7. The IC chip of claim 1 , wherein the second high-voltage transistor includes a high-voltage NMOS transistor having a source-drain path connected between the storage node and an output node of the decoding unit, and a gate receiving the second control signal.

8. The IC chip of claim 1 , wherein the decoding unit and first and second high-voltage transistors cooperate to shift low-voltage levels of the input signals to high-voltage levels stored by the storage node.

9. The IC chip of claim 1 , wherein one end of the capacitor is connected to the storage node and another end of the capacitor is connected to ground.

10. A source driving device, comprising:

a sampling latch configured to sample and latch image data input from outside;

a circuit block configured to pre-decode data output from the sampling latch, and shift and store a voltage level of the pre-decoded data in response to a control signal; and

a decoder configured to decode the pre-decoded image data and to transfer one of a plurality of gradation voltages, wherein:

the circuit block includes:

a first high-voltage transistor configured to precharge a storage node in response to a first control signal;

a capacitor coupled to the storage node;

a pre-decoding unit configured to decode a plurality of input signals and to output the decoded signal to the storage node; and

a second high-voltage transistor configured to transfer an output of the decoding unit to the storage node in response to a second control signal, and

the pre-decoding unit includes a plurality of low-voltage transistors coupled between a first supply voltage terminal and the second high-voltage transistor in series.

11. The source driving device of claim 10 , wherein the capacitor includes a parasitic capacitor.

12. The source driving device of claim 10 , further comprising a buffer configured to output a signal at the storage node to outside.

13. The source driving device of claim 12 , wherein the buffer includes high-voltage transistors.

14. The source driving device of claim 10 , wherein the low-voltage transistors include NMOS transistors whose gates receive the input signals.

15. The source driving device of claim 10 , further comprising a test unit configured to make some output signals of plural circuits in the pre-decoding unit corresponding to the circuit block to have the same logic value for a reliability test of the pre-decoding unit.

16. The source driving device of claim 15 , wherein the test unit includes a plurality of low-voltage transistors.

17. The source driving device of claim 10 , wherein the first high-voltage transistor includes a high-voltage PMOS transistor having a source-drain path connected between a second supply voltage terminal and the storage node, and a gate receiving the first control signal.

18. The source driving device of claim 10 , wherein the second high-voltage transistor includes a high-voltage NMOS transistor having a source-drain path connected between the storage node and an output node of the decoding unit, and a gate receiving the second control signal.

19. The source driving circuit of claim 10 , wherein the pre-decoding unit and first and second high-voltage transistors cooperate to shift low-voltage levels of the input signals to high-voltage levels stored by the storage node.

20. An integrated circuit (IC) chip, comprising:

a first high-voltage transistor configured to precharge a storage node in response to a first control signal;

a capacitor coupled to the storage node;

a decoding unit configured to decode input signals and to output a decoded signal to the storage node; and

a second high-voltage transistor configured to transfer an output of the decoding unit to the storage node in response to a second control signal, wherein

the decoding unit and the first and second high-voltage transistors cooperate to shift low-voltage levels of the input signals to high-voltage levels stored by the storage node.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2025
From: MAGNACHIP MIXED-SIGNAL, LTD.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 071813/0800 →
NUNC PRO TUNC ASSIGNMENT Recorded Mar 14, 2024
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: MAGNACHIP MIXED-SIGNAL, LTD.
Reel/Frame 066878/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2009
From: NISHIMURA, MASATO
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 023363/0234 →