Lamp assemblies and methods of making the same
View Patent ↗Lamp assemblies and methods of making the same are provided. Such a lamp assembly can include a heat sink and a light-emitting diode package that can be mounted to the heat sink. The light-emitting diode package can include a substrate with a top surface and bottom surface, a lens, and electrical contacts on the surface of the substrate. The lamp assembly can also include a printed circuit board with a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface. The printed circuit board can have electrical contacts thereon for electrical connection with the electrical contacts of the light-emitting diode package. The substrate of the light-emitting diode package can engage the opening of the printed circuit board to mechanically couple the light-emitting diode package to the printed circuit board. When assembled, a bottom surface of the substrate can be flush and aligned with a rear surface of the printed circuit board.
1. A lamp assembly comprising:
a heat sink;
at least one light-emitting diode package mounted to the heat sink, the light-emitting diode package comprising a substrate and electrical contacts;
a board comprising a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface, the board comprising electrical contacts for electrical connection with the electrical contacts of the light-emitting diode package, and
wherein the substrate of the light-emitting diode package engages one or more inner walls the opening of the board to mechanically couple the light-emitting diode package to the board frictionally via a solderless mechanical connection.
2. The lamp assembly according to claim 1 , wherein the substrate of the light-emitting diode package comprises a top surface and a bottom surface.
3. The lamp assembly according to claim 2 , wherein the electrical contacts of the light-emitting diode package are disposed only on the top surface of the substrate.
4. The lamp assembly according to claim 1 , wherein the substrate of the light-emitting diode package is mounted to the heat sink with a thermally conductive compound.
5. The lamp assembly according to claim 1 , wherein a shape of the opening in the board corresponds to a shape of the substrate of the light-emitting diode package.
6. The lamp assembly according to claim 5 , wherein lateral sides of the substrate of the light-emitting diode package frictionally engage the one or more inner walls of the board defining the opening therein.
7. The lamp assembly according to claim 1 , wherein the board comprises a printed circuit board.
8. The lamp assembly according to claim 1 , wherein the substrate of the light-emitting diode package comprises a lens.
9. The lamp assembly according to claim 8 , wherein a shape of the opening through the face surface of the board corresponds to a shape of a base of the lens of the light-emitting diode package and the board defines a recess on the rear surface of the board that forms a portion of the opening with the recess corresponding to a shape of the substrate of the light-emitting diode package.
10. The lamp assembly according to claim 9 , wherein lateral sides of the substrate of the light-emitting diode package frictionally engage the one or more inner walls of the board defining the recess so that only the lens extends above the face surface of the board.
11. The lamp assembly according to claim 9 , wherein the electrical contacts of the board are disposed within the recess of the board and electrical connection between the board and the light-emitting diode package is made by contact between the electrical contacts of the board and the electrical contacts of the light-emitting diode package on a top surface of the substrate of the light-emitting diode package.
12. The lamp assembly according to claim 11 , wherein the electrical contacts on the board comprise at least one of pogo pins, solder balls, spikes, and electrical receptacles.
13. The lamp assembly according to claim 1 , wherein the board further comprises one or more larger electrical contacts.
14. The lamp assembly according to claim 1 , wherein the board comprises one or more via holes with a thermal conductive material running therethrough with a plate of the thermal conductive material being positioned over the via holes on both the face surface and the rear surface of the board.
15. The lamp assembly according to claim 1 , wherein the board and the heat sink are secured together.
16. The lamp assembly according to claim 15 , wherein the board and the heat sink each comprise one or more securement holes that are alignable with each other and further comprising one or more attachment devices configured for insertion into the aligned securement holes to hold the board to the heat sink.
17. The lamp assembly according to claim 16 , wherein the one or more attachment devices are selected from the group consisting of screws, bolts, and rivets.
18. The lamp assembly according to claim 15 , wherein the board and the heat sink are secured together by an epoxy placed between the board and the heat sink.
19. The lamp assembly according to claim 15 , wherein securement of the board and the heat sink together holds the light-emitting diode package in place relative to the board within the lamp assembly.
20. The lamp assembly according to claim 1 , comprising a plurality of light-emitting diode packages mounted to the heat sink and comprising a plurality of openings of the board.
21. The lamp assembly according to claim 1 , wherein the electrical contacts of the board are disposed on the face surface of the board and electrical connection between the board and the light-emitting diode package is made by wires reflowed between the electrical contacts of the board and the electrical contacts of the light-emitting diode package on a top-side of the lamp assembly.
22. The lamp assembly according to claim 1 , wherein the electrical contacts of the board comprise spring contacts that are disposed on the face surface of the board and extend into the opening of the board, and electrical connection between the board and the light-emitting diode package is made by contact of the spring contacts of the board and the electrical contacts of the light-emitting diode package.
23. The lamp assembly according to claim 22 , wherein the board comprises one or more spring clips that are disposed on the face surface of the board and extend into the opening of the board, where the spring clips facilitate retention of the light-emitting diode package in the opening of the board.
24. A lamp assembly comprising:
a light-emitting diode package comprising a substrate with a top surface and bottom surface and electrical contacts on the substrate;
a board comprising a face surface, a rear surface opposite the face surface and at least one opening extending from the rear surface to the face surface that is alignable with at least a portion of the light-emitting diode package, the board comprising electrical contacts thereon for electrical connection with the electrical contacts of the light-emitting diode package; and
wherein the substrate of the light-emitting diode package engages one or more inner walls of the opening of the board to mechanically couple the light-emitting diode package to the board frictionally via a solderless mechanical connection so that the bottom surface of the substrate of the light-emitting diode package aligns along a common plane with the rear surface of the board.
25. The lamp assembly according to claim 24 , wherein a shape of the opening in the board corresponds to a shape of the substrate of the light-emitting diode package.
26. The lamp assembly according to claim 25 , wherein lateral sides of the substrate of the light-emitting diode package frictionally engage the one or more inner walls of the board defining the opening therein.
27. The lamp assembly according to claim 26 , wherein the electrical contacts of the board are disposed on the face surface of the board and electrical connection between the board and the light-emitting diode package is made by wires reflowed between the electrical contacts of the board and the electrical contacts of the light-emitting diode package on a top-side of the lamp assembly.
28. The lamp assembly according to claim 26 , wherein the electrical contacts of the board comprise spring contacts that are disposed on the face surface of the board and extend into the opening of the board, and electrical connection between the board and the light-emitting diode package is made by contact of the spring contacts of the board and the electrical contacts of the light-emitting diode package.
29. The lamp assembly according to claim 24 , wherein the light-emitting diode package comprises a lens.
30. The lamp assembly according to claim 29 , wherein a shape of the opening through the face surface of the board corresponds to a shape of a base of the lens of the light-emitting diode package and the board defines a recess on the rear surface of the board that forms a portion of the opening with the recess corresponding to a shape of the substrate of the light-emitting diode package.
31. The lamp assembly according to claim 30 , wherein lateral sides of the substrate of the light-emitting diode package frictionally engage inner walls of the board defining the recess so that only the lens extends above the face surface of the board.
32. The lamp assembly according to claim 30 , wherein the electrical contacts of the board are disposed within the recess of the board and electrical connection between the board and the substrate of the light-emitting diode package is made by contact between the electrical contacts of the board and electrical contacts on the top surface of the substrate of the light-emitting diode package.
33. The lamp assembly according to claim 32 , wherein the electrical contacts on the board comprise at least one of pogo pins, solder balls, spikes, and electrical receptacles.
34. The lamp assembly according to claim 24 , wherein the board comprises a printed circuit board.
35. The lamp assembly according to claim 34 , wherein the printed circuit board comprises one or more larger electrical contacts.
36. The lamp assembly according to claim 24 , further comprising a heat sink on which the substrate of the light-emitting diode package is attachable.
37. The lamp assembly according to claim 36 , wherein the board and the heat sink are secured together.
38. The lamp assembly according to claim 37 , wherein the board comprises one or more securement holes and the heat sink comprises one or more securement holes that are alignable with each other and further comprising one or more attachment devices configured for insertion into the aligned securement holes to hold the board to the heat sink.
39. The lamp assembly according to claim 37 , wherein the board and the heat sink are secured by an epoxy placed between the board and the heat sink.
40. The lamp assembly according to claim 37 , wherein securement of the board and the heat sink together holds the light-emitting diode package in place within the lamp assembly.
41. The lamp assembly according to claim 24 , comprising a plurality of light-emitting diode packages mounted to the heat sink and comprising a plurality of openings of the board.
42. The lamp assembly according to claim 24 , wherein the substrate of the light-emitting diode package engages the opening of the board to mechanically couple the light-emitting diode package to the board.
43. A lamp assembly comprising:
a heat sink;
a board comprising a face surface, a rear surface opposite the face surface, an opening extending from the face surface to the rear surface, and electrical contacts, at least a portion of the rear face of the board being mounted to the heat sink; and
at least one light emitting diode package having a substrate positioned in the opening of the board and mounted to the heat sink, the at least one light emitting diode package comprising electrical contacts for electrical connection with the electrical contacts of the board, wherein the electrical contacts of the package are only disposed on an upper surface of the substrate and do not extend beyond lateral side walls of the substrate.