Electronic component tester
View Patent ↗The electronic component tester includes: a socket configured to supply power to connection terminals for operating an electronic component; an electronic component mount member on which the electronic component is to be mounted; and a temperature adjusting member which is configured to come into contact with the electronic component mount member to keep the electronic component at a predetermined temperature. The electronic component mount member includes a heat transfer plate on which the electronic component is to be mounted and which is configured to come into contact with the temperature adjusting member, and an electronic component cover for covering the electronic component. The heat transfer plate includes through holes.
1. An electronic component tester comprising:
an electronic component mount member on which an electronic component having protruding connection terminals is to be mounted;
a socket configured to allow a current to flow through the connection terminals of the electronic component; and
a temperature adjusting member configured to keep the electronic component in a predetermined temperature environment, wherein
the electronic component mount member includes a heat transfer plate having a first surface which is configured to come into contact with the electronic component, a second surface opposite to the first surface, and a third surface which is configured to come into contact with the temperature adjusting member,
the heat transfer plate is configured to come into contact with the electronic component at the first surface, and
the first surface includes through holes of a size permitting insertion of the connection terminals.
2. The electronic component tester of claim 1 , wherein the third surface of the heat transfer plate which is configured to come into contact with the temperature adjusting member is perpendicular to the first surface.
3. The electronic component tester of claim 1 , wherein
on the electronic component mount member, multiple ones of the electronic component are mounted, and
the electronic components located next to each other are separated by a groove formed in the heat transfer plate.
4. The electronic component tester of claim 1 , wherein
the socket includes contact members which are configured to come into contact with the connection terminals to supply power to the connection terminals,
on the heat transfer plate, a terminal supporting member made of an insulative resin is provided, where the terminal supporting member faces openings of the through holes close to the second surface,
the contact members and the terminal supporting member are arranged in a position such that the contact members and the terminal supporting member nip the connection terminals, and
the connection terminals come into contact with the terminal supporting member to be kept in a state out of contact with the heat transfer plate.
5. The electronic component tester of claim 1 , wherein a thickness of the heat transfer plate is set to a thickness allowing tips of the connection terminals to protrude from the second surface when the connection terminals are inserted through the first surface of the heat transfer plate into the through holes, and a bottom surface of the electronic component comes into contact with the first surface.
6. The electronic component tester of claim 1 , wherein the electronic component mount member includes an electronic component cover for securing and holding the electronic component mounted on the electronic component mount member.
7. The electronic component tester of claim 6 , wherein the electronic component cover includes an elastic member for pressing the electronic component against the first surface.
8. The electronic component tester of claim 6 , wherein the electronic component cover includes an opening through which light output from the electronic component passes.