Printed wiring board and electronic apparatus
View Patent ↗According to one embodiment, a printed wiring board includes an insulating layer, a first conductor pattern on the insulating layer configured to be a signal line, and a second conductor pattern on the insulating layer. The second conductor pattern includes a larger conductor area than the first conductor pattern, and a slit which allows the second conductor pattern to stretch to follow a thermal expansion of the insulating layer.
1. A printed wiring board comprising:
an insulating layer;
a first conductor pattern on the insulating layer configured to be a signal line; and
a second conductor pattern on the insulating layer, the second conductor pattern comprising a main portion configured to be a power source layer or a ground layer, a conductor line configured to be a signal line, a clearance between the main portion and the conductor line, a plurality of first slits, and a plurality of second slits extending in a direction intersecting the first slits,
the first slits and the second slits being uniformly provided in an area which comprises the conductor line and an area which does not comprise the conductor line, and the first slit and the second slit next to the conductor line being shorter in length in order to avoid the conductor line and being connected to the clearance, and
the first slits and the second slits being separate from one another and aligned alternately.
2. The printed wiring board of claim 1 , wherein
the first conductor pattern comprises an impedance line,
the second conductor pattern comprises a reference area facing the impedance line, and the first slits and second slits next to the reference area are shorter in length in order to avoid the reference area.
3. The printed wiring board of claim 1 , wherein
the insulating layer has a larger thermal expansion coefficient than the second conductor pattern, and
the first slits and the second slits are configured to open when the insulating layer expands, and the second conductor pattern is configured to follow the expansion of the insulating layer.
4. The printed wiring board of claim 1 , wherein
a reinforcing plate having a larger thermal expansion coefficient than the second conductor pattern is attached to the printed wiring board, and
the first slits and the second slits are configured to open when the reinforcing plate expands, and the second conductor pattern is configured to follow the expansion of the reinforcing plate.