Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide

1. A thermoplastic composition comprising:

a) from about 10 to about 79.9 wt % of at least one semi-aromatic polyamide having a glass transition equal to or greater than 100° C. and a melting point of equal to or greater than 280° C., as determined with differential scanning calorimetry at a scan rate of 20° C./min;

b) from about 20 to about 80 wt % of a thermally conducting filler having a thermal conductivity of at least 5 W/mK; and

c) from about 0.1 to about 10 wt % of at least one hyperbranched polyesteramide having terminal hydroxyl groups; and

wherein said at least one semi-aromatic polyamide is selected from the group consisting of poly(decamethylene terephthalamide), poly(nonamethylene terephthalamide), hexamethylene terephthalamide/2-methylpentamethylene terephthalamide copolyamide; hexamethylene adipamide/hexamethylene terephthalamide/hexamethylene isophthalamide copolyamide; poly(caprolactam/hexamethylene terephthalamide); and hexamethylene terephthalamide/hexamethylene isophthalamide copolymer.

2. The thermoplastic composition of claim 1 wherein said thermally conducting filler is zinc oxide, magnesium oxide, boron nitride, graphite flakes, graphite fibers, calcium fluoride powder, or zinc sulfide.

3. The thermoplastic composition of claim 1 wherein said thermally conducting filler is calcium fluoride.

4. The thermoplastic composition of claim 1 wherein said at least one semi-aromatic polyimide is hexamethylene terephthalamide/2-methylpentamethylene terephthalamide copolyamide.

5. The thermoplastic composition of claim 1 wherein the hyperbranched polyesteramide has repeat units of one or more amino diols selected from the group consisting of diethanolamine, diethanolamine, dipropanolamine, diisopropanolamine, dibutanolamine, bis(2-hydroxy-1-butyl) amine, and dicyclohexanolamine; and one or more anhydrides selected from the group consisting of succinic anhydride and phthalic anhydride.

6. The thermoplastic composition of claim 1 further comprising

d) about 15 to about 50 wt % of a filler having a thermal conductivity less than 5 W/mK.

7. The thermoplastic composition of claim 6 wherein said filler having a thermal conductivity less than 5 W/mK is selected from the group consisting of glass fiber, glass fiber having a non-circular cross section, and a combination thereof.

8. A molded article comprising the composition of claim 1 or 6 .

9. The thermoplastic composition of claim 1 , wherein the thermoplastic composition has a melt viscosity at 320° C. that is at least 10% less than a thermoplastic composition comprising the at least one semi-aromatic polyimide and the thermally conducting filler, without the at least one hyperbranched polyesteramide having terminal hydroxyl groups.

10. The thermoplastic composition of claim 9 , wherein the melt viscosity is at least 30% less.