Method and system for the modular design and layout of integrated circuits
An integrated circuit (IC) and fabrication method thereof is provided that include the steps of specifying a plurality of required tile modules suitable for a particular end application, each of the modular tiles being configured to perform a predetermined function and constructed to have approximately the same length and width dimensions. The modular tiles are used to form the IC in a standard IC fabrication process. In many implementations, physical layout of the IC does not include the step of routing. Capabilities also include configuring the modular tiles to have programmable performance parameters and configuring the modular tiles to cooperate usefully with one another based on a programmable parameter.
1. An integrated circuit, comprising:
a first modular tile having a square shape, wherein the first modular tile performs a first function;
a second modular tile having a square shape of the same size as the first modular tile, wherein the second modular tile performs a second function, wherein an end application of the integrated circuit is operational when the first function and the second function are performed regardless of which edge of the first modular tile is placed adjacent to any edge of the second modular tile, and wherein each of the first modular tile and the second modular tile has a standardized set of connectors disposed on each of its four edges such that a first set of connectors on an edge of the first modular tile aligns with a second set of connectors on an edge of the second modular tile regardless of which edge of the first modular tile is adjacent to any edge of the second modular tile.
2. The integrated circuit of claim 1 , wherein the integrated circuit controls a voltage output by a power regulator.
3. The integrated circuit of claim 1 , further comprising:
a third modular tile, wherein the first modular tile communicates with the second modular tile through the first set of connectors, through the third modular tile, and through the second set of connectors.
4. The integrated circuit of claim 1 , wherein the end application is performed using a set of electrical signals that is common to both the first modular tile and the second modular tile, wherein the first set of connectors and the second set of connectors form a standard signal bus, and wherein the common set of electrical signals is communicated via the standard signal bus.
5. The integrated circuit of claim 4 , wherein the standard signal bus comprises a communication signal line, a control signal line, a power supply bus and a ground bus.
6. The integrated circuit of claim 1 , wherein the first modular tile includes a programmable memory, wherein the second modular tile is a master control tile, and wherein an external microprocessor uses the master control tile to program the programmable memory.
7. The integrated circuit of claim 6 , wherein the integrated circuit controls a voltage output by a power regulator, wherein the programmable memory controls a programmable performance parameter of the first modular tile, and wherein the programmable performance parameter is taken from the group consisting of: an output voltage of the power regulator, an output current of the power regulator, and an input current of the power regulator.
8. The integrated circuit of claim 1 , further comprising:
a third modular tile, wherein each of the first, second and third modular tiles has a programmable memory, and wherein each bit of each programmable memory has a unique address.
9. An integrated circuit, comprising:
a first modular tile having a square shape, wherein the first modular tile performs a first function; and
a second modular tile having a square shape of the same size as the first modular tile, wherein the second modular tile performs a second function, wherein an end application of the integrated circuit is operational when the first function and the second function are performed regardless of which edge of the first modular tile is placed adjacent to any edge of the second modular tile, and wherein the first modular tile comprises a means for transmitting signals to the second modular tile regardless of which edge of the first modular tile is placed adjacent to any edge of the second modular tile.
10. The integrated circuit of claim 9 , wherein the signals transmitted by the means are common to both the first modular tile and the second modular tile, and wherein the means forms a standard signal bus through which the common set of electrical signals is communicated.