Method and system for the modular design and layout of integrated circuits
An integrated circuit (IC) and fabrication method thereof is provided that include the steps of specifying a plurality of required tile modules suitable for a particular end application, each of the modular tiles being configured to perform a predetermined function and constructed to have approximately the same length and width dimensions. The modular tiles are used to form the IC in a standard IC fabrication process. In many implementations, physical layout of the IC does not include the step of routing. Capabilities also include configuring the modular tiles to have programmable performance parameters and configuring the modular tiles to cooperate usefully with one another based on a programmable parameter.
1. A method of making an integrated circuit, comprising:
specifying a first modular tile having a polygon shape with all substantially right angles, wherein the first modular tile performs a first function, and wherein the first modular tile has a first bond pad adaptable to be connected to a package of the integrated circuit or to a printed circuit board;
specifying a second modular tile having a second shape, wherein the second shape is a polygon having all substantially right angles, wherein the second modular tile performs a second function, wherein the second modular tile has a second bond pad adaptable to be connected to the package of the integrated circuit or to the printed circuit board, wherein the first bond pad is connected to a programmable input/output circuit of the first modular tile, and wherein the programmable input/output circuit is coupled to a circuit element in the second modular tile; and
generating a physical layout of the integrated circuit such that an end application of the integrated circuit is operational when the first function and the second function are performed regardless of which edge of the first modular tile is placed adjacent to any edge of the second modular tile, wherein a first set of connectors on an edge of the first modular tile aligns with a second set of connectors on an edge of the second modular tile, and wherein the first modular tile communicates with the second modular tile regardless of which edge of the first modular tile is placed adjacent to any edge of the second modular tile.
2. The method of claim 1 , wherein the second modular tile includes a programmable memory, wherein the first modular tile is a master control tile, and wherein an external microprocessor uses the programmable input/output circuit of the first modular tile to program the programmable memory.
3. The method of claim 1 , wherein the programmable input/output circuit communicates with the second modular tile through the first set of connectors, through a third modular tile, and through the second set of connectors.
4. The method of claim 1 , wherein the end application is performed using a set of electrical signals that is common to both the first modular tile and the second modular tile, and wherein the common set of electrical signals is communicated between the first modular tile and the second modular tile through the first set of connectors and the second set of connectors.
5. The method of claim 1 , wherein the first modular tile generates a reference voltage that is used by the second modular tile to perform the second function.
6. The method of claim 1 , wherein the first modular tile generates a clock signal that is used by the second modular tile to perform the second function.
7. The method of claim 1 , wherein the first function is taken from the group consisting of: converting an analog input into a digital output, converting a digital input into an analog output, converting a DC input voltage into a regulated DC output voltage, and charging a battery.
8. The method of claim 1 , wherein the first modular tile includes a programmable memory, wherein the programmable memory controls a programmable performance parameter, and wherein the programmable performance parameter is taken from the group consisting of: an output voltage of a power regulator, an output current of the power regulator, and an input current of the power regulator.
9. The method of claim 1 , wherein the end application is regulating a voltage output by a power regulator, wherein the first modular tile has a programmable performance parameter, and wherein the programmable performance parameter is taken from the group consisting of: a power-up characteristic of the power regulator, a steady-state operation characteristic of the power regulator, a fault condition handling characteristic of the power regulator, and a shutdown characteristic of the power regulator.
10. The method of claim 1 , wherein the programmable input/output circuit drives an LED backlight with programmable brightness.
11. The method of claim 1 , wherein a circuit element in the first modular tile is coupled to the second bond pad.
12. An integrated circuit, comprising:
a first modular tile having a polygon shape with all substantially right angles, wherein the first modular tile performs a first function, and wherein the first modular tile has a first bond pad; and
a second modular tile having a second shape, wherein the second shape is a polygon having all right angles, wherein the second modular tile performs a second function, wherein the second modular tile has a second bond pad, wherein an end application of the integrated circuit is operational when the first function and the second function are performed regardless of which edge of the first modular tile is placed adjacent to any edge of the second modular tile, wherein the first bond pad is connected to a programmable input/output circuit of the first modular tile, wherein the programmable input/output circuit is coupled to a circuit element in the second modular tile, wherein a first set of connectors on an edge of the first modular tile aligns with a second set of connectors on an edge of the second modular tile, and wherein the first modular tile communicates with the second modular tile regardless of which edge of the first modular tile is adjacent to any edge of the second modular tile.
13. The integrated circuit of claim 12 , wherein the second modular tile includes a programmable memory, wherein the first modular tile is a master control tile, and wherein an external microprocessor uses the programmable input/output circuit of the first modular tile to program the programmable memory.
14. The integrated circuit of claim 12 , wherein the first bond pad is adaptable to be connected to a package of the integrated circuit or to a printed circuit board.
15. The integrated circuit of claim 12 , wherein the integrated circuit controls a voltage output by a power regulator.
16. The integrated circuit of claim 12 , further comprising:
a third modular tile, wherein the first modular tile communicates with the second modular tile through the first set of connectors, through the third modular tile, and through the second set of connectors.
17. The integrated circuit of claim 16 , wherein each of the first, second and third modular tiles has a programmable memory, and wherein each bit of each programmable memory has a unique address.
18. The integrated circuit of claim 17 , wherein the integrated circuit controls a voltage output by a power regulator, wherein the programmable memory of the first modular tile controls a programmable performance parameter of the first modular tile, and wherein the programmable performance parameter is taken from the group consisting of: an output voltage of the power regulator, an output current of the power regulator, and an input current of the power regulator.
19. An integrated circuit, comprising:
a first modular tile having a polygon shape with all substantially right angles, wherein the first modular tile performs a first function, wherein the first modular tile has a first bond pad adaptable to be connected to a package of the integrated circuit or to a printed circuit board, and wherein the first bond pad is connected to a programmable input/output circuit of the first modular tile; and
a second modular tile having a second shape, wherein the second shape is a polygon having all right angles, wherein the second modular tile performs a second function, wherein an end application of the integrated circuit is operational when the first function and the second function are performed regardless of which edge of the first modular tile is placed adjacent to any edge of the second modular tile, and wherein the first modular tile comprises a means for transmitting signals to the second modular tile regardless of which edge of the first modular tile is placed adjacent to any edge of the second modular tile.
20. The integrated circuit of claim 19 , wherein the second modular tile includes a programmable memory, wherein an external microprocessor uses the programmable input/output circuit of the first modular tile to transmit signals to program the programmable memory, and wherein the signals transmitted by the means are common to both the first modular tile and the second modular tile, and wherein the means forms a standard signal bus through which the common set of electrical signals is communicated.