Direct contact leadless flip chip package for high current devices
View Patent ↗Some exemplary embodiments of an advanced direct contact leadless package and related structure and method, especially suitable for packaging high current semiconductor devices, have been disclosed. One exemplary structure comprises a mold compound enclosing a first contact lead frame portion, a paddle portion, and an extended contact lead frame portion held together by a mold compound. A first semiconductor device is attached on top of the lead frame portions as a flip chip, while a second semiconductor device is attached to a bottom side of said paddle portion and is in electrical contact with said the first semiconductor device. The extended contact lead frame portion is in direct electrical contact with the second semiconductor device without using a bond wire. Alternative exemplary embodiments may include additional extended lead frame portions, paddle portions, and semiconductor devices in various configurations.
1. A semiconductor package comprising:
a first extended contact lead frame portion, a paddle portion, and a second extended contact lead frame portion held together by a mold compound;
a first semiconductor device attached as a flip chip to a top side of said first extended contact lead frame portion, a top side of said paddle portion, and a top side of said second extended contact lead frame portion, said first semiconductor device enclosed by said mold compound;
a second semiconductor device attached to a bottom side of said paddle portion and in electrical contact with said first semiconductor device;
a third semiconductor device attached to a bottom side of said paddle portion and in electrical contact with said first semiconductor device; and
said first and second extended contact lead frame portions being respectively in direct electrical contact with said second and third semiconductor devices without using a bond wire.
2. The semiconductor package of claim 1 , further comprising a printed circuit board (PCB) attached to a bottom side of said second semiconductor device and a bottom side of said third semiconductor device.
3. The semiconductor package of claim 1 , wherein said first semiconductor device is a control integrated circuit (IC).
4. The semiconductor package of claim 1 , wherein said second semiconductor device is a first power transistor and said third semiconductor device is a second power transistor.
5. The semiconductor package of claim 4 , wherein a gate terminal of said first power transistor is in direct electrical contact with said first extended contact lead frame portion.
6. The semiconductor package of claim 4 , wherein a gate terminal of said second power transistor is in direct electrical contact with said second extended contact lead frame portion.
7. A semiconductor package comprising:
a first extended contact lead frame portion, a paddle portion, and a second extended contact lead frame portion;
a first semiconductor device attached as a flip chip to a top side of said first extended contact lead frame portion, a top side of said paddle portion, and a top side of said second extended contact lead frame portion;
a second semiconductor device attached to a bottom side of said paddle portion and in electrical contact with said first semiconductor device;
a third semiconductor device attached to a bottom side of said paddle portion and in electrical contact with said first semiconductor device; and
said first and second extended contact lead frame portions being respectively in electrical contact with said second and third semiconductor devices without using a bond wire.
8. The semiconductor package of claim 7 , further comprising a printed circuit board (PCB) attached to a bottom side of said second semiconductor device and a bottom side of said third semiconductor device.
9. The semiconductor package of claim 7 , wherein said first semiconductor device is a control integrated circuit (IC).
10. The semiconductor package of claim 7 , wherein said second semiconductor device is a first power transistor and said third semiconductor device is a second power transistor.
11. The semiconductor package of claim 10 , wherein a gate terminal of said first power transistor is in electrical contact with said first extended contact lead frame portion.
12. The semiconductor package of claim 10 , wherein a gate terminal of said second power transistor is in electrical contact with said second extended contact lead frame portion.
13. A semiconductor package comprising:
a first extended contact lead frame portion, a paddle portion, and a second extended contact lead frame portion;
a control integrated circuit (IC) attached as a flip chip to a top side of said first extended contact lead frame portion, a top side of said paddle portion, and a top side of said second extended contact lead frame portion;
a first power transistor attached to a bottom side of said paddle portion and in electrical contact with said control IC;
a second power transistor attached to a bottom side of said paddle portion and in electrical contact with said control IC; and
said first and second extended contact lead frame portions being respectively in electrical contact with said first and second power transistors without using a bond wire.
14. The semiconductor package of claim 13 , further comprising a printed circuit board (PCB) attached to a bottom side of said first power transistor and a bottom side of said second power transistor.
15. The semiconductor package of claim 13 , wherein a gate terminal of said first power transistor is in electrical contact with said first extended contact lead frame portion.
16. The semiconductor package of claim 13 , wherein a gate terminal of said second power transistor is in electrical contact with said second extended contact lead frame portion.