Method for producing transparent conductive layer comprising TIO2 and method for producing semiconductor light-emitting element utilizing said method for producing transparent conductive layer
View Patent ↗When a p-layer 4 composed of GaN is maintained at ordinary temperature and TNO is sputtered thereon by an RF magnetron sputtering method, a laminated TNO layer 5 is in an amorphous state. Then, there is included a step of thermally treating the amorphous TNO layer in a reduced-pressure atmosphere where hydrogen gas is substantially absent to thereby crystallize the TNO layer. At the sputtering, an inert gas is passed through together with oxygen gas, and volume % of the oxygen gas contained in the gas passed through is 0.10 to 0.15%. In this regard, oxygen partial pressure is 5×10 −3 Pa or lower. The temperature of the thermal treatment is 500° C. for about 1 hour.
1. A method for producing a transparent conductive electrode comprising TiO 2 contacting with a p-type Group III nitride-based compound semiconductor layer, the method comprising:
laminating an amorphous TiO 2 layer on the p-type Group III nitride-based compound semiconductor layer, said laminating being performed by a sputtering method and without heating; and
thermally treating the amorphous TiO 2 layer at 400° C. to 800° C. to crystallize the amorphous TiO 2 layer and form an anatase TiO 2 layer,
wherein said sputtering method comprises passing through a gas including oxygen and an inert gas, and
wherein the p-type Group III nitride-based compound semiconductor layer is cooled to a temperature equal to or lower than a room temperature for laminating the amorphous TiO 2 layer after a film deposition of the amorphous TiO 2 layer.
2. The method according to claim 1 , wherein the anatase TiO 2 layer is doped with one or more elements selected from the group consisting of Nb, Ta, Mo, As, Sb, Al, and W.
3. The method according to claim 1 , wherein the laminating of the amorphous TiO 2 layer is performed in the inert gas passed through together with the oxygen, and a ratio of the oxygen in the gas passed through is 0.05 to 0.20% by volume.
4. The method according to claim 3 , wherein the ratio of the oxygen in the gas passed through is 0.10% to 0.15% by volume.
5. The method according to claim 1 , further comprising:
patterning the amorphous TiO 2 .
6. The method according to claim 1 , further comprising:
laminating the Group III nitride-based compound semiconductor layer on a substrate.
7. The method according to claim 6 , further comprising:
forming a buffer layer that comprises AlN on the substrate, and laminating an n-type Group III nitride-based compound semiconductor layer on the buffer layer.
8. The method according to claim 7 , wherein the n-type Group III nitride-based compound semiconductor layer comprises a contact layer comprising n-GaN and a clad layer formed by multiple laminations of InGaN and GaN.
9. The method according to claim 7 , further comprising:
laminating an active layer on the n-type Group III nitride-based compound semiconductor layer.
10. The method according to claim 9 , wherein the active layer comprises a multi-quantum well structure including multiple laminations of AlGaN and InGaN.
11. The method according to claim 9 , further comprising:
laminating a p-type Group III nitride-based compound semiconductor layer on the active layer.
12. The method according to claim 11 , wherein the p-type Group III nitride-based compound semiconductor layer comprises a clad layer formed by multiple laminations of InGaN and AlGaN and a contact layer comprising p-GaN.
13. The method according to claim 11 , further comprising:
thermally treating a laminate structure comprising the n-type Group III nitride-based compound semiconductor layer, the active layer, and the p-type Group III nitride-based compound semiconductor layer, prior to said thermally treating the amorphous TiO 2 layer.
14. The method according to claim 13 , further comprising:
sputtering the laminate structure prior to said thermally treating the anatase TiO 2 layer.
15. The method according to claim 13 , wherein, in the sputtering method, the oxygen is mixed into the inert gas as a carrier gas.
16. The method according to claim 11 , further comprising:
etching parts of the n-type Group III nitride-based compound semiconductor layer, the active layer, and the p-type Group III nitride-based compound semiconductor layer to partially expose the n-type Group III nitride-based compound semiconductor layer.
17. The method according to claim 11 , further comprising:
forming a p-pad electrode on the anatase TiO 2 layer; and
forming an n-pad electrode on an exposed portion of the n-type Group III nitride-based compound semiconductor layer.
18. The method according to claim 1 , further comprising laminating a ZnO layer that is doped with Al, the anatase TiO 2 layer being doped with Nb.
19. The method according to claim 1 , wherein the ratio of the oxygen in the gas passed through is in a range from 0.125% to 0.15% by volume.
20. The method according to claim 1 , wherein, in said sputtering method, the gas is passed through a chamber, and
wherein a base pressure in the chamber is lowered when the oxygen is passed through the chamber.