IP Library Granted Patent US 8,093,093
Granted Patent B2
US 8,093,093 · App. 12/585,476 · Granted Jan 10, 2012

Semiconductor imaging instrument and manufacturing method thereof, and camera and manufacturing method thereof

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Quick Facts
Patent No.
US 8,093,093
App. No.
12/585,476
Granted
Jan 10, 2012
Kind
B2
Abstract

A semiconductor imaging instrument is disclosed, including a prescribed substrate, an imaging device array provided on the substrate and having plural semiconductor imaging devices and electrodes for outputting a signal charge upon photoelectric conversion of received light, and a color filter layer provided on the imaging device array, with an infrared light absorbing dye being contained in the color filter layer.

Claims (12)

1. A manufacturing method of a semiconductor imaging instrument comprising the steps of:

forming an imaging device array having plural semiconductor imaging devices and electrodes on a prescribed substrate; and

forming a color filter layer containing an infrared absorbing dye on the imaging device array formed on the substrate, wherein said infrared absorbing dye contains 25 wt % of visible light absorbing dye and 25 wt % of the infrared light absorbing dye.

2. The manufacturing method of a semiconductor imaging instrument according to claim 1 , wherein in forming the color filter layer containing an infrared absorbing dye, a mixture in which a visible light absorbing dye material and an infrared light absorbing dye material are dispersed in a prescribed proportion in a desired resist material is used.

3. The manufacturing method of a semiconductor imaging instrument according to claim 2 , wherein a cyanine based dye which is configured by the following formula:

is used as the infrared light absorbing dye material.

4. The manufacturing method of a semiconductor imaging instrument according to claim 2 , wherein a squalium based dye which is configured by the following formula:

is used as the infrared light absorbing dye material.

5. A manufacturing method of a camera comprising the steps of:

forming an imaging device array having plural semiconductor imaging devices and electrodes on a prescribed substrate;

forming a color filter layer containing an infrared absorbing dye on the imaging device array formed on the substrate, wherein said infrared absorbing dye contains 25 wt % of visible light absorbing dye and 25 wt % of the infrared light absorbing dye; and

providing a lens in a side of a light irradiation face of the color filter layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →