Temperature controller for direct mounting to the object to be controlled
An integrated solid-state temperature controller that is mountable to an object the temperature of which is controlled by the solid-state temperature controller, or is mountable in a space in which the temperature is controlled by the solid-state temperature controller. The solid-state temperature controller able to withstand and continue to operate in extremes of temperatures at which the object or space is controlled, and able to withstand and continue to operate in extremes of temperatures of the object or space when the temperature is not being controlled.
1. A device for controlling temperature of an object or space comprising:
a package physically connected to the object or space in which the temperature is to be controlled, the package being an integral unit comprising:
a solid-state temperature sensor that senses the temperature of the object or the space;
at least one of a current or voltage reference that provides a temperature reference;
a comparing unit that compares a sensed temperature signal from the solid-state temperature sensor with the temperature reference and generates a switching signal based on that comparison;
a solid-state switch that outputs a control signal from the package based on the generated switching signal from the comparing unit;
a first thermal conductor that protrudes from a surface of the package and contacts the object or a surface in the space; and
a second mechanically non-rigid thermal connector disposed between the first thermal conductor and the solid-state temperature sensor and that transfers the thermal state of the object or the surface in the space from the first thermal conductor to the solid-state temperature sensor; and
a temperature changing unit connected to the package, and controlled by the control signal from the package,
wherein the temperature changing unit controls the temperature of the object or the space in a range of greater than 90° C.
2. The device according to claim 1 , wherein the temperature changing unit controls the temperature of the object or the space in a range of greater than 110° C.
3. The device according to claim 1 , wherein the surface from which the first thermal conductor protrudes is concave.
4. The device according to claim 1 , wherein a set temperature of the device has an accuracy of less than ±0.1° C.
5. The device according to claim 1 , wherein the comparing unit switches the solid-state switch on if a temperature measured by the solid-state temperature sensor is below a first temperature, and switches the solid-state switch off if the temperature measured by the solid-state temperature sensor is above a second temperature, the difference between the first temperature and the second temperature defining a deadband for the device.
6. The device according to claim 5 , wherein the deadband is less than 0.5° C.
7. The device according to claim 5 , wherein the first temperature and the second temperature are set via a wired or wireless connection from an external programmer.
8. The device according to claim 1 , wherein the comparing unit is a proportional integral differential controller.
9. The device according to claim 8 , wherein the comparing unit generates the switching signal using a pulse width modulation or frequency modulation technique.
10. A device for controlling temperature of an object or space comprising:
a package physically connected to the object or space in which the temperature is to be controlled, the package being an integral unit comprising;
a solid-state temperature sensor that senses the temperature of the object or the space;
at least one of a current or voltage reference that provides a temperature reference;
a comparing unit that compares a sensed temperature signal from the solid-state temperature sensor with the temperature reference and generates a switching signal based on that comparison;
a solid-state switch that outputs a control signal from the package based on the generated switching signal from the comparing unit;
a first thermal conductor that protrudes from a surface of the package and contacts the object or a surface in the space; and
a second mechanically non-rigid thermal connector disposed between the first thermal conductor and the solid-state temperature sensor and that transfers the thermal state of the object or the surface in the space from the first thermal conductor to the solid-state temperature sensor; and
a temperature changing unit connected to the package, and controlled by the control signal from the package,
wherein the temperature changing unit controls the temperature of the object or the space in a range of less than −15° C.
11. The device according to claim 10 , wherein the temperature changing unit controls the temperature of the object or the space in a range of less than −30° C.
12. The device according to claim 10 , wherein the surface from which the first thermal conductor protrudes is concave.
13. The device according to claim 10 , wherein a set temperature of the device has an accuracy of less than ±0.1° C.
14. The device according to claim 10 , wherein the comparing unit switches the solid-state switch on if a temperature measured by the solid-state temperature sensor is below a first temperature, and switches the solid-state switch off if the temperature measured by the solid-state temperature sensor is above a second temperature, the difference between the first temperature and the second temperature defining a deadband for the device.
15. The device according to claim 14 , wherein the deadband is less than 0.5° C.
16. The device according to claim 14 , wherein the first temperature and the second temperature are set via a wired or wireless connection from an external programmer.
17. The device according to claim 10 , wherein the comparing unit is a proportional integral differential controller.
18. The device according to claim 17 , wherein the comparing unit generates the switching signal using a pulse width modulation or frequency modulation technique.
19. A device for controlling temperature of an object or space comprising:
a package immediately adjacent and physically connected to the object or space in which the temperature is to be controlled, the package being an integral unit comprising:
a solid-state temperature sensor that senses the temperature of the object or the space,
at least one of a current or voltage reference that provides a temperature reference,
a comparing unit that compares a sensed temperature signal from the solid-state temperature sensor with the temperature reference and generates a switching signal based on that comparison, and
a solid-state switch that outputs a control signal from the package based on the generated switching signal from the comparing unit;
a temperature changing unit connected to the package, and controlled by the control signal from the package; and
a thermal conductor that protrudes from a surface of the package and contacts the object or a surface in the space to transfer the thermal state of the object or the surface in the space to the solid-state temperature sensor,
wherein the temperature changing unit controls the temperature of the object or the space in a range of greater than 90° C.; and
wherein the at least one of a current or voltage reference, the comparing unit, and the solid-state switch are thermally isolated from the solid-state temperature sensor.
20. The device according to claim 19 , further comprising
a circuit board made of a low thermal conductivity material;
wherein the solid-state temperature sensor is located on one side of the circuit board; and
wherein the at least one of a current or voltage reference, the comparing unit and the solid-state switch are mounted on the opposite side of the circuit board from the solid-state temperature sensor.
21. The device according to claim 20 , further comprising
a housing comprised of a low thermal conductivity polymer;
wherein the solid-state temperature sensor, the at least one of a current or voltage reference, the comparing unit, the solid-state switch and the circuit board are located within the housing.
22. The device according to claim 21 , wherein the circuit board is movably mounted to the housing such that relative movement between the circuit board and the housing is permitted.
23. A device for controlling temperature of an object or space comprising:
a package immediately adjacent and physically connected to the object or space in which the temperature is to be controlled, the package being an integral unit comprising:
a solid-state temperature sensor that senses the temperature of the object or the space,
at least one of a current or voltage reference that provides a temperature reference,
a comparing unit that compares a sensed temperature signal from the solid-state temperature sensor with the temperature reference and generates a switching signal based on that comparison, and
a solid-state switch that outputs a control signal from the package based on the generated switching signal from the comparing unit;
a temperature changing unit connected to the package, and controlled by the control signal from the package; and
a thermal conductor that protrudes from a surface of the package and contacts the object or a surface in the space to transfer the thermal state of the object or the surface in the space to the solid-state temperature sensor;
wherein the temperature changing unit controls the temperature of the object or the space in a range of less than −15° C.; and
wherein the at least one of a current or voltage reference, the comparing unit, and the solid-state switch are thermally isolated from the solid-state temperature sensor.
24. The device according to claim 23 , further comprising
a circuit board made of a low thermal conductivity material;
wherein the solid-state temperature sensor is located on one side of the circuit board; and
wherein the at least one of a current or voltage reference, the comparing unit and the solid-state switch are mounted on the opposite side of the circuit board from the solid-state temperature sensor.
25. The device according to claim 24 , further comprising
a housing comprised of a low thermal conductivity polymer;
wherein the solid-state temperature sensor, the at least one of a current or voltage reference, the comparing unit, the solid-state switch and the circuit board are located within the housing.
26. The device according to claim 25 , wherein the circuit board is movably mounted to the housing such that relative movement between the circuit board and the housing is permitted.
27. A device for controlling temperature of an object or space comprising:
a package configured to be physically connected to the object or space in which the temperature is to be controlled, the package being an integral unit comprising:
a solid-state temperature sensor that senses the temperature of the object or the space,
at least one of a current or voltage reference that provides a temperature reference,
a comparing unit that compares a sensed temperature signal from the solid-state temperature sensor with the temperature reference and generates a switching signal based on that comparison, and
a solid-state switch that outputs a control signal from the package based on the generated switching signal from the comparing unit; and
a first thermal conductor that protrudes from a surface of the package to contact the object or a surface in the space; and
a second mechanically non-rigid thermal connector disposed between the first thermal conductor and the solid-state temperature sensor and that transfers the thermal state of the object or the surface in the space from the first thermal conductor to the solid-state temperature sensor;
wherein the device is designed to control the temperature of the object or the space in a range of greater than 90° C.