Camera module package
View Patent ↗A camera module package is disclosed. The camera module package is capable of preventing defects caused by foreign bodies and enhancing product reliability by reducing the time consumed in a packaging process for manufacturing a camera module, and of reducing the size of a package and manufacturing costs by excluding the use of gold wires.
1. A camera module package comprising:
a housing having an inner space in an upper portion thereof;
a lens barrel coupled to the housing through the inner space and receiving one or more lenses;
an image sensor including an imaging area converting light, falling thereon via the lens, into an electrical signal, and a sensor contact pad formed on an upper side thereof;
a board including a cavity receiving the image sensor, and an external contact pad formed on an upper side thereof; and
a connection part electrically connecting the external contact pad to the sensor contact pad,
wherein the cavity has substantially a same depth as a thickness of the image sensor such that the upper side of the image sensor and the upper side of the board are on a same level, and
wherein the connection part is provided using screen-printing and covers the sensor contact pad and the external contact pad integrally to electrically connect the sensor contact pad to the external contact pad.
2. The camera module package of claim 1 , wherein the cavity has a greater size than the image sensor to form a gap between the cavity and edges of the image sensor.
3. The camera module package of claim 1 , wherein the connection part is formed of a conductive material.
4. The camera module package of claim 1 , further comprising an adhesive provided between the image sensor and the cavity to fix the image sensor in the cavity.
5. The camera module package of claim 4 , wherein the adhesive is provided along edges of the image sensor to fix the image sensor in the cavity.
6. The camera module package of claim 4 , wherein the adhesive has a top surface on substantially the same plane as top surfaces of the image sensor and the board.
7. The camera module package of claim 1 , further comprising a filter provided on the image sensor to protect the imaging area of the image sensor from external foreign bodies.