Electronic interface apparatus and method and system for manufacturing same
View Patent ↗A method for manufacture of an electronic interface card ( 100 ) including defining a pair of apertures in a substrate layer ( 116 ), associating an antenna ( 112 ) with the substrate layer ( 116 ) such that opposite ends of the antenna ( 112 ) terminate at the apertures, placing a metal element in each of the apertures, connecting the ends of the antenna to the metal elements, laminating the substrate layer together with a top layer ( 114 ) and a bottom layer ( 118 ), forming a recess ( 122 ) in the top layer and the substrate layer, attaching end of connection wires ( 130 ) to the metal elements, attaching opposite ends of the connection wires ( 130 ) to a chip module ( 120 ) and sealing the chip module in the recess ( 122 ).
1. A method for manufacture of a chip card having an electronic interface, comprising:
defining a pair of apertures in a substrate layer;
associating an antenna with said substrate layer such that opposite ends of said antenna terminate at said apertures, wherein said associating is performed after said defining;
placing a metal element in each of said apertures, wherein said placing is performed after said associating;
connecting said ends of said antenna to said metal elements, wherein said connecting is performed after said placing;
laminating said substrate layer together with a top layer and a bottom layer, wherein said laminating is performed after said connecting;
forming a recess in said top layer and said substrate layer to expose the metal elements in the recess formed, wherein said forming is performed after said laminating;
attaching ends of connection wires to said metal elements exposed in the recess;
attaching opposite ends of said connection wires to a chip module; and
inserting the chip module into said recess and sealing said chip module in said recess, wherein the steps of attaching said ends and said opposite ends of said connection wires to said metal elements and said chip module, respectively, are carried out while said chip module is positioned completely outside of said recess, and wherein each of said connection wires is a single integral piece and has sufficient length to extend outside of said recess after said ends of said connection wires are attached to said metal elements and said opposite ends of said connection wires are attached to said chip module.
2. A method according to claim 1 and also comprising providing a first additional substrate layer and a second additional substrate layer onto the underside of said substrate layer prior to said laminating.
3. A method according to claim 1 and wherein said top layer comprises a first top substrate layer and a second top substrate layer.
4. A method according to claim 3 and also comprising exposing a recessed surface of said second top layer adjacent said recess and wherein said sealing comprises:
placing an adhesive on an underside of said chip module; and
inserting said chip module into said recess such that said underside engages said recessed surface.
5. A method according to claim 1 and also comprising folding said wires underneath said chip module.
6. A method according to claim 1 and wherein said method is automated.
7. A method according to claim 1 and wherein said attaching ends of connection wires to said metal elements comprises laser bonding.
8. A method according to claim 1 and wherein said attaching opposite ends of said connection wires to a chip module comprises soldering.
9. A method for manufacture of an electronic interface card according to claim 1 and wherein said wires have a length substantially greater than the distance between their respective opposite ends in said electronic interface card.