Front end module

1. A front end module comprising:

an antenna path; and

a triplexer that is connected to the antenna path, to a first signal path, to a second signal path, and to a third signal path;

a first switch to connect the first signal path to one of at least four first partial paths;

a second switch to connect the second signal path to one of at least four second partial paths;

a substrate; and

at least one chip that is on the substrate, the triplexer comprising part of the substrate and part of at least one chip on the substrate;

wherein the first signal path is for transmitting signals in at least two first frequency bands that are for different transmission systems;

wherein the second signal path is for transmitting signals in at least two second frequency bands that are for different transmission systems;

wherein the third signal path is for transmitting signals in a third frequency band;

wherein a passband of the third signal path is between passbands of the first signal path and the second signal path;

wherein the triplexer comprises a low-pass filter that is connected to the first signal path and a high-pass filter that is connected to the second signal path;

wherein the triplexer comprises a band-pass filter that is connected to the third signal path;

wherein the high-pass filter comprises a capacitor and an inductor that are electrically connected, and the low-pass filter comprises a capacitor and an inductor that are electrically connected; and

wherein the band-pass filter comprises a surface acoustic wave (SAW) filter or a bulk acoustic resonator (BAW) filter.

2. The front end module of claim 1 , wherein the at least four first partial paths comprise at least two receiving paths, at least one transmitting path, and at least one transceiving path.

3. The front end module of claim 1 , wherein the at least four second partial paths comprise at least two receiving paths, at least one transmitting path, and at least one transceiving path.

4. The front end module of claim 2 , wherein the at least one transmitting path is for transmitting data for at least two different transmission systems.

5. The front end module of claim 2 , wherein a reception filter is in each receiving path;

wherein a transmission filter is in each transmitting path; and

wherein a reception filter is in the third signal path.

6. The front end module of claim 5 , wherein reception filters and transmission filters comprise parts of at least one chip that is mounted on the substrate.

7. The front end module of claim 2 , wherein a duplexer is in each transceiving path.

8. The front end module of claim 7 , wherein each duplexer comprises part of at least one chip that is on a substrate.

9. The front end module of claim 1 , wherein the first and second switches comprise parts of at least one chip that is on the substrate.

10. The front end module of claim 2 , wherein a preamplifier is in each receiving path;

wherein a power amplifier is in each transmitting path;

wherein each preamplifier comprises part of at least one LNA chip that is on the substrate; and

wherein each power amplifier comprises part of at least one PA chip that is on the substrate.

11. A front end module comprising:

a triplexer that is connectable to an antenna path, to a first signal path, to a second signal path, and to a third signal path;

a first switch to connect the first signal path to one of at least four first partial paths, at least some of the four first partial paths comprising first amplifiers;

a second switch to connect the second signal path to one of at least four second partial paths, at least some of the four first partial paths comprising second amplifiers;

wherein the front end module is a component that is surface-mountable;

wherein the first signal path is for transmitting signals in at least two first frequency bands that are for different transmission systems;

wherein the second signal path is for transmitting signals in at least two second frequency bands that are for different transmission systems;

wherein the third signal path is for transmitting signals in a third frequency band;

wherein a passband of the third signal path is between passbands of the first signal path and the second signal path;

wherein the triplexer comprises a low-pass filter that is connected to the first signal path and a high-pass filter that is connected to the second signal path;

wherein the triplexer comprises a band-pass filter that is connected to the third signal path;

wherein the high-pass filter comprises a capacitor and an inductor that are electrically connected, and the low-pass filter comprises a capacitor and an inductor that are electrically connected; and

wherein the band-pass filter comprises a surface acoustic wave (SAW) filter or a bulk acoustic wave (BAW) filter.

12. The front end module of claim 11 , wherein the at least four first partial paths comprise at least two receiving paths, at least one transmitting path, and at least one transceiving path.

13. The front end module of claim 11 , wherein the at least four second partial paths comprise at least two receiving paths, at least one transmitting path, and at least one transceiving path.

14. The front end module of claim 12 , wherein the at least one transmitting path is for transmitting data for at least two different transmission systems.

15. The front end module of claim 12 , wherein a reception filter is in each receiving path;

wherein a transmission filter is in each transmitting path; and

wherein a reception filter is in the third signal path.

16. The front end module of claim 15 , wherein reception filters and transmission filters comprise parts of at least one chip that is mounted on a substrate.

17. The front end module of claim 12 , wherein a duplexer is in each transceiving path.

18. The front end module of claim 17 , wherein each duplexer comprises part of at least one chip that is on a substrate.

19. The front end module of claim 11 , wherein the first and second switches comprise parts of at least one chip that is on a substrate.

20. The front end module of claim 12 , wherein a preamplifier is in each receiving path;

wherein a power amplifier is in each transmitting path;

wherein each preamplifier comprises part of at least one LNA chip that is on a substrate; and

wherein each power amplifier comprises part of at least one PA chip that is on the substrate.