Reducing defects in electronic switching devices
View Patent ↗A technique for isolating electrodes on different layers of a multilayer electronic device across an array containing more than 100000 devices on a plastic substrate. The technique comprises depositing a bilayer of a first dielectric layer ( 6 ) of a solution-processible polymer dielectric and a layer of parylene ( 9 ) to isolate layers of conductor or semiconductor on different levels of the device. The density of defects located in the active area of one of the multilayer electronic devices is typically more than 1 in 100000.
1. An electronic switching device comprising:
source and drain electrodes,
a semiconductor structure providing a semiconductor channel between the source and drain electrodes, and
a gate electrode separated from the semiconductor structure by a gate dielectric structure;
wherein said gate dielectric structure comprises:
a first non-conformal solution-processed dielectric layer which comprises pinholes, and is in contact with said semiconductor structure; and
a second conformal dielectric layer between said first dielectric layer and said gate electrode, which second dielectric layer penetrates and coats a surface of the first dielectric layer,
wherein the electronic switching device is a top-gate device; and wherein the second conformal dielectric layer comprises a polymer.
2. The electronic switching device as claimed in claim 1 , wherein the first non-conformal solution-processed dielectric layer has a thickness of less than 200 nm.
3. The electronic switching device as claimed in claim 1 , wherein the second conformal dielectric layer has a thickness of between 100-1000 nm.
4. The electronic switching device as claimed in claim 1 , wherein the field effect mobility is greater than 0.01 cm 2 /Vs.
5. The electronic switching device as claimed in claim 1 , wherein said gate electrode is located above said semiconductor layer and said gate dielectric structure.
6. An array of electronic switching devices according to claim 1 formed on a substrate; wherein not more than 0.1% of the total number of the devices formed on the substrate exhibit a leakage current of more than 1 μA/cm 2 at an electric field of 5×10 5 V/cm.
7. The array of electronic switching devices as claimed in claim 6 , wherein the first non-conformal solution-processed dielectric layer has a thickness of less than 200 nm.
8. The array of electronic switching devices as claimed in claim 6 , wherein the second conformal dielectric layer has a thickness of between 100-1000 nm.
9. The array of electronic switching device as claimed in claim 6 , wherein the field effect mobility of each electronic switching device is greater than 0.01 cm 2 /Vs.
10. The electronic switching device as claimed in claim 1 , wherein said second conformal dielectric layer is the uppermost layer of the gate dielectric structure between said semiconductor structure and said gate electrode.
11. The electronic switching device according to claim 1 , wherein the first non-conformal solution-processed dielectric layer protects the semiconductor structure against degradation by the second conformal dielectric layer.
12. The electronic switching device according to claim 1 , wherein the second conformal dielectric layer is deposited by transporting reactive monomers on a flow of inert gas to a surface of said first dielectric layer, where said reactive monomers react together and form said polymer.
13. The electronic switching device according to claim 1 , wherein the second dielectric layer comprises parylene.