Composite multilayer wiring board
View Patent ↗Electronic components on a printed wiring board can be protected from the impact force of a fall, whereby the electrical and mechanical reliability of the electronic apparatus components can be greatly improved, and moreover, smaller size, lighter weight, higher functionality, and greater multifunctionality can be achieved. The composite multilayer wiring board of the present invention includes a plurality of intermediate layers each interposed between a plurality of printed wiring boards, at least one of the plurality of intermediate layers being composed of a resin material having a dilatancy characteristic.
1. A composite multilayer wiring board comprising: a plurality of printed wiring boards, and a plurality of intermediate layers each interposed between a plurality of said printed wiring boards; wherein at least one of said plurality of intermediate layers is composed of a resin material that has a dilatancy characteristic; wherein said intermediate layer at the position most distant from a neutral plane of the composite multilayer wiring board is composed of the resin that has the dilatancy characteristic and wherein said intermediate layer at the position most distant from said neutral plane suppresses a shearing stress that accompanies a deformation velocity of said intermediate layer at the position most distant from said neutral plane due to the dilatancy characteristic of said intermediate layer at the position most distant from said neutral plane.
2. The composite multilayer wiring board as set forth in claim 1 , wherein all of said plurality of intermediate layers are composed of a resin material having a dilatancy characteristic.
3. The composite multilayer wiring board as set forth in claim 1 , wherein hole-shaped vacancies are formed in said intermediate layer.
4. The composite multilayer wiring board as set forth in claim 3 , wherein said vacancies are arranged in rows in matrix form.
5. The composite multilayer wiring board as set forth in claim 1 , wherein said intermediate layer is made up by a strip-shaped block group in which strip-shaped blocks are arranged in parallel rows in the direction of the short sides of the blocks.
6. The composite multilayer wiring board as set forth in claim 5 , wherein said strip-shaped blocks are arranged such that the long sides of these blocks are orthogonal to the long sides of strip-shaped blocks that make up another said intermediate layer.
7. The composite multilayer wiring board as set forth in claim 1 , wherein said intermediate layer is formed by a matrix-shaped block group in which rectangular blocks, for which both short sides and long sides have dimensions that are no greater than half the outer dimensions of the principal surfaces of said printed wiring boards, are arranged in rows in matrix form.
8. The composite multilayer wiring board as set forth in claim 1 , wherein said intermediate layer and said printed wiring boards are bonded by the adhesion of said intermediate layer.
9. The composite multilayer wiring board as set forth in claim 1 , wherein the outer dimensions of the principal surface of said intermediate layer are smaller than the outer dimensions of the principal surfaces of said printed wiring boards.
10. The composite multilayer wiring board as set forth in claim 1 , wherein just said intermediate layer at the position most distance from said neutral plane has the dilatancy characteristic, and no other intermediate layer has the dilatancy characteristic.