IP Library Granted Patent US 8,145,020
Granted Patent B2
US 8,145,020 · App. 12/603,893 · Granted Mar 27, 2012

Semiconductor device

Assignee: Toshiba Mitsubishi—Electric Industrial Systems Corporation
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Quick Facts
Patent No.
US 8,145,020
App. No.
12/603,893
Granted
Mar 27, 2012
Kind
B2
Abstract

A semiconductor device includes a direct light-triggered thyristor triggered by an optical gate signal, a first optical fiber connected to the direct light-triggered thyristor and through which the optical gate signal is transmitted, a second optical fiber used to extend the first optical fiber, and a inter-optical-fiber relaying unit configured to connect the first optical fiber to the second optical fiber and to input the optical gate signal output from the second optical fiber to the first optical fiber.

Claims (34)

1. A semiconductor device comprising:

a structure;

a direct light-triggered thyristor enclosed inside the structure, the direct light-triggered thyristor being triggered by an optical gate signal;

a first flexible light-conducting member which:

has a first end connected to the direct light-triggered thyristor;

has a second end extending out of the structure; and

transmits the optical gate signal to the direct light-triggered thyristor;

a second flexible light-conducting member located outside the structure; and

a relaying unit located outside the structure and configured to:

connect the second end of the first light-conducting member to the second light-conducting member; and

transmit the optical gate signal from the second light-conducting member to the first light-conducting member;

the first light-conducting member comprising an intermediate portion outside of the structure and of the relaying unit.

2. The device according to claim 1 , further comprising:

a radiating unit configured to radiate heat generated from the direct light-triggered thyristor.

3. The device according to claim 1 , wherein the first light-conducting member has a diameter larger than that of the second light-conducting member.

4. The device according to claim 1 , further comprising:

an optical gate signal generating unit connected with the second light-conducting member and configured to generate the optical gate signal.

5. A semiconductor device comprising:

a structure;

a plurality of direct light-triggered thyristors enclosed inside the structure, the plurality of direct light-triggered thyristors being connected in series and triggered by optical gate signals;

a plurality of first flexible light-conducting members which:

have first ends connected with the plurality of direct light-triggered thyristors;

have second ends extending out of the structure; and

transmit the plurality of optical gate signals to the direct light-triggered thyristors, respectively;

a plurality of second flexible light-conducting members located outside the structure; and

a plurality of relaying units located outside the structure and configured to:

connect the second ends of the plurality of first light-conducting members to the plurality of second light-conducting members; and

transmit the plurality of optical gate signals output from the plurality of second light-conducting members to the plurality of first light-conducting members, respectively;

the first light-conducting members comprising intermediate portions outside of the structure and of the relaying units.

6. The device according to claim 5 , further comprising:

a plurality of radiating units configured to radiate heat generated from the plurality of direct light-triggered thyristors, respectively.

7. The device according to claim 5 , wherein the plurality of first light-conducting members have diameters larger than those of the plurality of second light-conducting members, respectively.

8. The device according to claim 5 , further comprising:

an optical gate signal generating unit connected to the plurality of second light-conducting members and configured to generate the plurality of optical gate signals, respectively.

Assignments (2)
CHANGE OF NAME Recorded Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 22, 2009
From: FUJIMOTO, TAKAFUMI
To: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
Reel/Frame 023410/0204 →
Continuity (2)
Continuation PCTJP2007060631 · May 24, 2007
Related Publication 20100040329A1 · Feb 18, 2010