ORGANIC LIGHT EMITTING DIODE DISPLAY
An organic light emitting diode (OLED) display is disclosed. One aspect includes a display panel assembly, a support member supporting edges of the display panel assembly and including an opening exposing a rear surface of the display panel assembly, and a buffer member attached to the rear surface of the display panel assembly exposed through the opening of the support member.
1 . An organic light emitting diode (OLED) display device, comprising:
a display panel assembly;
a support member supporting edges of the display panel assembly and having an opening exposing a rear surface of the display panel assembly; and
a buffer member attached to the rear surface of the display panel assembly through the opening of the support member.
2 . The device of claim 1 , wherein the support member comprises a bottom part supporting the edges of the display panel assembly, and a side wall part formed to protrude from the bottom part.
3 . The device of claim 2 , wherein the bottom part of the support member and the edge of the display panel assembly contact in an overlap area having a width ranging from about 0.5 mm to about 1.0 mm.
4 . The device of claim 2 , wherein the side wall part of the support member is spaced apart from the display panel assembly.
5 . The device of claim 2 , wherein the side wall part protrudes from the bottom part at least as far as the far surface of the display panel assembly.
6 . The device of claim 1 , wherein the buffer member has a thickness ranging from about 0.2 mm to about 0.5 mm.
7 . The device of claim 6 , wherein the buffer member comprises an adhesive layer facing the display panel assembly.
8 . The device of claim 1 , wherein the support member has a thickness ranging from about 0.2 mm to about 0.5 mm.
9 . The device of claim 8 , wherein the support member is made of one or more of a resin-based material including polycarbonate (PC), and a metal-based material comprising at least one of stainless steel (SUS), magnesium (Mg), aluminum (Al), and an alloy thereof.
10 . The device of claim 3 , wherein the support member has a thickness ranging from about 0.2 mm to about 0.5 mm.
11 . The device of claim 10 , wherein the support member is made of one or more of a resin-based material including polycarbonate (PC), and a metal-based material comprising at least one of stainless steel (SUS), magnesium (Mg), aluminum (Al), and an alloy thereof.
12 . The device of claim 6 , wherein the support member has a thickness ranging from about 0.2 mm to about 0.5 mm.
13 . The device of claim 12 , wherein the support member is made of one or more of a resin-based material including polycarbonate (PC), and a metal-based material comprising at least one of stainless steel (SUS), magnesium (Mg), aluminum (Al), and an alloy.
14 . The device of claim 1 , wherein the buffer member is spaced apart from the support member.
15 . The device of claim 1 , wherein the buffer member is configured to absorb energy from an impact to device.
16 . The device of claim 1 , wherein the display panel assembly comprises an encapsulation substrate sealed to a display substrate.
17 . The device of claim 16 , wherein the display substrate comprises a plurality of pixels configured to display an image.
18 . The device of claim 16 , wherein the display substrate comprises an integrated circuit, configured to send signals to the pixels.
19 . The device of claim 1 , wherein the support member comprises a connection part configured to receive a flexible printed circuit board.
20 . The device of claim 1 , wherein the buffer member is formed of an adhesive material.