Image forming apparatus having power supplying path

1. An image forming apparatus comprising:

a housing that is fixedly placed in the image forming apparatus and integrally accommodates an imaging portion that includes at least an image holding member;

a transferring unit that is disposed against the image holding member so that the transferring unit is capable of pressing and separating the image holding member; and

a high-voltage power supplying unit that supplies a high voltage,

wherein a power supplying path that is formed on an outer surface of the housing so that the high voltage is supplied from the high-voltage power supplying unit to the imaging portion and the transferring unit via the power supplying path, and

wherein the housing has a positioning portion that positions the transferring unit with respect to the image holding member, and the conductive wire material presses the transferring unit with an end of the conductive wire material so that the transferring unit is pressed to the positioning portion.

2. The image forming apparatus according to claim 1 , wherein the power supplying path is formed of a conductive wire material, and

the conductive wire material is disposed, along the outer surface of the housing, so that a force is applied in a direction that enhances a condition of the transferring unit being pressed against the image holding member.

3. The image forming apparatus according to claim 2 , wherein the conductive wire material is wound around a support provided on the housing near the positioning portion, to thereby push the transferring unit to the positioning portion.

4. The image forming apparatus according to claim 1 , wherein the high-voltage power supplying unit, the imaging portion and the transferring unit are disposed so that a direction of connection between the high-voltage power supplying unit and the imaging portion and a direction in which the transferring unit is pressed against the imaging portion are substantially the same.

5. The image forming apparatus according to claim 1 , wherein a groove for the power supplying path is formed on a surface of the housing, and the conductive wire material is disposed in the groove.