Light emitting diode package
View Patent ↗The present invention provides a light emitting diode package including: a package mold having a first cavity and a second cavity with a smaller size than that of the first cavity; first and second electrode pads provided on the bottom surfaces of the first cavity and the second cavity, respectively; an LED chip mounted on the first electrode pad; a wire for providing electrical connection between the LED chip and the second electrode pad; and a molding material filled within the first cavity and the second cavity.
1. A light emitting diode package comprising:
a package mold having a first cavity and a second cavity having a smaller size than that of the first cavity;
first and second electrode pads provided on the bottom surfaces of the first cavity and the second cavity, respectively;
an LED chip mounted on the first electrode pad;
a wire for providing electrical connection between the LED chip and the second electrode pad; and
a molding material filled within the first cavity and the second cavity, wherein the first cavity and the second cavity come into contact with each other.
2. The light emitting diode package of claim 1 , wherein the first cavity and the second cavity are formed to have the same depth.
3. The light emitting diode package of claim 1 , wherein the second cavity is formed to have a thinner depth than that of the first cavity.
4. A light emitting diode package comprising:
a package mold having a first cavity and a second cavity having a smaller size than that of the first cavity;
first and second electrode pads provided on the bottom surfaces of the first cavity and the second cavity, respectively;
an LED chip mounted on the first electrode pad;
a wire for providing electrical connection between the LED chip and the second electrode pad;
a molding material filled within the first cavity and the second cavity, wherein the first cavity and the second cavity are provided to be spaced apart from each other; and
a groove formed on the package mold between the first cavity and the second cavity so that a top portion of the first cavity and a top portion of the second cavity are in communication with each other.
5. The light emitting diode package of claim 4 , wherein the groove has a smaller size than that of the second cavity.
6. The light emitting diode package of claim 4 , wherein the groove is formed to have a thinner depth than that of the first cavity.
7. The light emitting diode package of claim 4 , wherein the first cavity and the second cavity are formed to have the same depth.
8. The light emitting diode package of claim 4 , wherein the second cavity is formed to have a thinner depth than that of the first cavity.
9. A light emitting diode package comprising:
a package mold provided with a first cavity and a plurality of second cavities with a smaller size than that of the first cavity;
a plurality of first electrode pads provided to be the same number as that of the second cavities on a bottom surface of the first cavity;
a second electrode pad provided on a bottom surface of the second cavities;
LED chips mounted on each of the first electrode pads;
wires for providing electrical connection of the LED chips and the second electrode pad; and
a molding material filled in the first cavity and the second cavities.
10. The light emitting diode package of claim 9 , wherein the first cavity and the second cavities are formed to have the same depth.
11. The light emitting diode package of claim 9 , wherein the second cavities are formed to have a thinner depth than that of the first cavity.
12. The light emitting diode package of claim 9 , wherein the first cavity and the second cavities come into contact with one another.
13. The light emitting diode package of claim 9 , wherein the first cavity and the second cavities are provided to be spaced from one another.