IP Library Granted Patent US 8,023,057
Granted Patent B2
US 8,023,057 · App. 12/608,844 · Granted Sep 20, 2011

Thin film transistor array panel used for liquid crystal display and a manufacturing method thereof

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Quick Facts
Patent No.
US 8,023,057
App. No.
12/608,844
Granted
Sep 20, 2011
Kind
B2
Abstract

A method for manufacturing a TFT array panel is presented. The method includes: forming a gate line and a gate electrode on a substrate with a first mask; depositing an insulation layer on the gate line and on the gate electrode; depositing a semiconductor layer; depositing an n+ amorphous silicon layer; forming a data line, a source electrode and a drain electrode on the substrate with a second mask; removing the exposed portion of the n+ amorphous silicon layer; forming a passivation film on the semiconductor layer, the n+ amorphous silicon layer, the data line, the source electrode and the drain electrode by using a third mask such that a portion of the drain electrode and the semiconductor layer is exposed; removing the exposed portion of the semiconductor layer; and forming a pixel electrode connected to the exposed portion of the drain electrode by using a fourth mask.

Claims (23)

1. A method for manufacturing a thin film transistor array panel, the method comprising:

forming a gate line and a gate electrode on a substrate by using a first mask;

depositing an insulation layer on the gate line and on the gate electrode;

depositing a semiconductor layer on the insulating layer;

depositing an n+ amorphous silicon layer on the semiconductor layer;

forming a data line, a source electrode and a drain electrode on the substrate by using a second mask before first etching of the n+ amorphous silicon layer;

removing the exposed portion of the n+ amorphous silicon layer;

forming a passivation film on the semiconductor layer, the n+ amorphous silicon layer, the data line, the source electrode and the drain electrode by using a third mask, the passivation film exposing a portion of the drain electrode and a portion of the semiconductor layer;

removing the exposed portion of the semiconductor layer by using the passivation film as a mask; and

forming a pixel electrode connected to the exposed portion of the drain electrode by using a fourth mask.

2. The method of claim 1 , wherein the passivation film is formed of an opaque material.

3. A method for manufacturing a thin film transistor array panel, the method comprising:

forming a gate line and a gate electrode on a substrate by using a first mask;

depositing an insulation layer on the gate line and on the gate electrode;

depositing a semiconductor layer on the insulating layer;

depositing an n+ amorphous silicon layer on the semiconductor layer;

forming a data line, a source electrode and a drain electrode on the substrate by using a second mask before first etching of the n+ amorphous silicon layer;

removing the exposed portion of the n+ amorphous silicon layer;

forming a passivation film on the semiconductor layer, the n+ amorphous silicon layer, the data line, the source electrode and the drain electrode by using a third mask, the passivation film exposing a portion of the drain electrode and a portion of the semiconductor layer;

removing the exposed portion of the semiconductor layer and the insulation layer, wherein the semiconductor layer is removed by using the passivation film as a mask; and

forming a pixel electrode connected to the exposed portion of the drain electrode by using a fourth mask,

wherein the passivation film overlaps portions of the gate line and the gate electrode.

4. The method of claim 3 , wherein the passivation film is formed of an opaque material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029016/0057 →