Modular printhead assembly with releasable printhead modules
View Patent ↗A modular printhead assembly includes an elongate chassis; an elongate ink reservoir assembly mounted on the chassis and defining a plurality of distinct elongate ink supply channels; a plurality of printhead modules serially arranged along and releasably engaged with the ink reservoir, each printhead module having ink chambers in fluid communication with respective distinct supply channels; and a plurality of spaced apart sets of tubular filling formations serially arranged along the elongate ink reservoir, each filling formation of a set being in fluid communication with one distinct ink supply channel.
1. A modular printhead assembly comprising:
an elongate chassis;
an elongate ink reservoir assembly mounted on the chassis and defining a plurality of distinct elongate ink supply channels;
a plurality of printhead modules serially arranged along and releasably engaged with the ink reservoir, each printhead module having ink chambers in fluid communication with respective distinct supply channels; and
a plurality of spaced apart sets of tubular filling formations serially arranged along the elongate ink reservoir, each filling formation of a set being in fluid communication with one distinct ink supply channel.
2. A modular printhead assembly as claimed in claim 1 , wherein each set comprises a quartet of filling formations.
3. A modular printhead assembly as claimed in claim 1 , wherein each printhead module comprises a plurality of filling funnels configured to be releasably engaged with a respective set of filling formations.
4. A modular printhead as claimed in claim 3 , wherein a collar is arranged on each filling funnel to facilitate engagement of the funnels and the filling formations.
5. A modular printhead assembly as claimed in claim 1 , further comprising snap-fitting arrangements interposed between the printhead modules and the ink reservoir module to releasably engage the printhead module with the ink reservoir.
6. A modular printhead assembly as claimed in claim 1 , wherein each printhead module comprises a micro-electromechanical integrated circuit bonded by adhesive to a tape automated bond film, the micro-electromechanical integrated circuit also being electrically coupled to the tape automated bond film.
7. A modular printhead assembly as claimed in claim 6 , wherein each printhead module further comprises a micromolding to which the micro-electromechanical integrated circuit and tape automated bond film assembly is operatively attached.