ADHESIVE COMPOSITION COMPRISING A FORMALDEHYDE-CONTAINING AMINOPLAST RESIN AND A CATALYSING COMPOUND
The invention relates to an adhesive composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound, with the catalysing compound being an acid or is able to release an acid with a pKa lower than 4 and with the formaldehyde-containing aminoplast resin having a F/(NH 2 ) 2 ratio lower than or equal to 1. The catalysing compound comprises at most 11 wt. % of an ammonium salt. The invention also relates to a process for the preparation of board material using the adhesive composition according to the invention and to the board material thus obtainable.
1 . Adhesive composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound, characterised in that the catalysing compound is an acid or is able to release an acid with a pKa lower than 6, under the proviso that the catalysing compound comprises at most 11 wt. % of an ammonium salt, and in that the formaldehyde-containing aminoplast resin has a F/(NH 2 ) 2 ratio which is lower than or equal to 1.
2 . Adhesive composition according to claim 1 , wherein the catalysing compound is an acid or is able to release an acid with a pKa lower than 5.
3 . Adhesive composition according to claim 1 , wherein the catalysing compound is a monoacid or a methyl ester, melamine salt or urea salt of one or more monoacids with a pKa lower than 4 or a methylolated urea or melamine compound esterified with one or more monoacids with a pKa lower than 4.
4 . Adhesive composition according to claim 3 , wherein the catalysing compound is formic acid or a methyl ester, melamine salt or urea salt of formic acid or a methylolated urea or melamine compound esterified with formic acid.
5 . Adhesive composition according to claim 4 , wherein the catalysing compound is formic acid.
6 . Adhesive composition according to claim 1 , wherein the catalysing compound is acetic acid.
7 . Adhesive composition according to claim 1 , wherein the pH of the adhesive composition is lower than or equal to 7.
8 . Adhesive composition according to claim 7 , wherein the pH of the adhesive composition is 6.5-5.5.
9 . Process for the preparation of a board material comprising mixing cellulose-containing compounds with an adhesive composition, wherein the adhesive composition comprises a formaldehyde-containing aminoplast resin and a catalysing compound, and wherein the catalysing compound is an acid or is able to release an acid with a pKa lower than 6, under the proviso that the catalysing compound comprises at most 6 wt. % of an ammonium salt, and in that the formaldehyde-containing aminoplast resin has a F/(NH 2 ) 2 ratio which is lower than or equal to 0.95, and wherein the adhesive composition has a pH in the range of 7 to 5.5 and exhibits a formaldehyde potential when cured of lower than 8 mg/100 g according to DIN NEN 120, and then curing the mixture of cellulose-containing compounds and adhesive composition.
10 . Board material made by the process according to claim 9 .
11 . Board material according to claim 10 , having a formaldehyde potential according to DIN NEN 120 is lower than 8 mg/100 g.
12 . Board material according to claim 11 , having a formaldehyde potential according to DIN NEN 120 of lower than 6.5 mg/100 g.
13 . Board material according to claim 10 having an internal bond strength which complies with the specification stated in EN 312-5 for load-bearing board material for use in damp conditions measured according to NEN-EN 1087-1 (V100).
14 . Process for the preparation of a plywood board material comprising applying an adhesive composition comprising a formaldehyde-containing aminoplast resin and a catalysing compound, wherein the catalysing compound is an acid or is able to release an acid with a pKa lower than 6, under the proviso that the catalysing compound comprises at most 6 wt. % of an ammonium salt, and in that the formaldehyde-containing aminoplast resin has a F/(NH 2 ) 2 ratio which is lower than or equal to 1.2, and wherein the adhesive composition has a pH in the range of 7 to 5.5 and exhibits a formaldehyde potential when cured of lower than 8 mg/100 g according to DIN NEN 120, and thereafter curing the applied adhesive composition.
15 . Plywood material made according to the process of claim 14 .
16 . Plywood material according to claim 15 , having a tensile strength according to the Japanese Agricultural Standard (JAS) of at least 7 kg/cm 2 .
17 . Plywood material according to claim 15 , having a formaldehyde emission according to the Japanese Agricultural Standard (JAS) of not more than 0.3 mg/100 ml of water.