Data center cooling
View Patent ↗A system for cooling air in a data center includes a data center having electronic equipment in operation, a cooling water source, and a plurality of on-floor cooling units. The cooling water source is configured to retain at maximum capacity a total amount of water. Each on-floor cooling unit is configured to cool air heated by a portion of the electronic equipment in the data center using water from the cooling water source. The total amount of water is insufficient to maintain a leaving air temperature of each on-floor cooling unit below an inside setpoint when a temperature outside of the data center is above a predetermined external temperature.
1. A system for providing cooled air to electronic equipment, comprising:
a data center having electronic equipment, wherein the electronic equipment is in operation;
a plurality of modules connected by a first header, wherein each module comprises a plurality of on-floor cooling units in the data center and a cooling water source; and
at least one chiller connected by a second header such that the at least one chiller is in fluid connection with more than one module in the plurality of modules.
2. The system of claim 1 , wherein a number of chillers that includes the at least one chiller is less than a number of modules that includes the plurality of modules.
3. The system of claim 1 , wherein each on-floor cooling unit comprises a corresponding proportioning control valve configured to control a flow of cooling water through the on-floor cooling unit.
4. The system of claim 1 , wherein the cooling water source comprises a cooling tower.
5. The system of claim 1 , wherein each on-floor cooling unit comprises a heat exchanger configured to transfer heat from the electronic equipment to the cooling water source.
6. The system of claim 5 , wherein the heat exchanger comprises coils located adjacent to one or more common hot air plenums that receive heated air from the electronic equipment.
7. A system for cooling air in a data center, comprising:
a data center having electronic equipment, wherein the electronic equipment is in operation;
a cooling water source configured to retain at maximum capacity a total amount of water; and
a plurality of on-floor cooling units in the data center, each on-floor cooling unit configured to cool air heated by a portion of the electronic equipment in the data center using water from the cooling water source;
wherein the total amount of water is insufficient to maintain a leaving air temperature of each on-floor cooling unit below an inside setpoint when a temperature outside of the data center is above a predetermined external temperature.
8. The system of claim 7 , wherein the cooling water source consists of a cooling tower.
9. The system of claim 7 , wherein each on-floor cooling unit comprises a heat exchanger configured to transfer heat from the electronic equipment to the cooling water source.
10. The system of claim 9 , wherein the heat exchanger comprises coils located adjacent to one or more common hot air plenums that receive heated air from the electronic equipment.
11. The system of claim 7 , wherein:
the system is located in a geographical region; and
for at least 90% of a year, temperatures outside of the data center are below the predetermined external temperature.
12. The system of claim 11 , wherein for at least 95% of the year, temperatures outside of the data center are below the predetermined external temperature.
13. The system of claim 4 , wherein the cooling tower comprises a hybrid cooling tower, the hybrid cooling tower comprising a water-water heat exchanger.
14. The system of claim 1 , wherein at least one of the plurality of on-floor cooling units comprises a number of fans configured to draw air across the electronic equipment and to maintain a predetermined temperature rise of the air across the electronic equipment.
15. The system of claim 14 , wherein the temperature at an exhaust end of the electronic equipment is between about 113° F. and 212° F.
16. The system of claim 1 , wherein the plurality of on-floor cooling units are coupled to the cooling water source in parallel such that the cooling water source is operable to provide cooling water to each of the on-floor cooling units simultaneously.
17. The system of claim 3 further comprising:
a controller in communication with the proportional control valve of each on-floor cooling unit and configured to operate the control valves individually in response to signals received from one or more sensors.
18. The system of claim 17 , wherein at least one of the one or more sensors is configured to measure a leaving air temperature of an on-floor cooling unit.
19. The system of claim 17 , wherein at least one of the one or more sensors is configured to measure the temperature outside the data center.
20. The system of claim 1 , wherein the temperature of cooling water provided to at least one of the on-floor cooling units by the cooling water source is sufficient to inhibit air within the data center from condensing.
21. The system of claim 1 , wherein cooling water is provided to at least one of the on-floor cooling units at a temperature of at least about 68° F.
22. The system of claim 1 , wherein the cooling water source comprises a cooling water circuit and a condenser circuit, the condenser circuit being configured to remove heat from the cooling water circuit.
23. The system of claim 22 , wherein the cooling water circuit comprises a closed-loop circuit.
24. The system of claim 22 , wherein the cooling water circuit and the condenser circuit are arranged such as to form an indirect water-side economizer.
25. The system of claim 8 , wherein the cooling tower comprises a hybrid cooling tower, the hybrid cooling tower comprising a water-water heat exchanger.
26. The system of claim 7 , wherein at least one of the plurality of on-floor cooling units comprises a number of fans configured to draw air across the electronic equipment and to maintain a predetermined temperature rise of the air across the electronic equipment.
27. The system of claim 26 , wherein the temperature at an exhaust end of the electronic equipment is between about 113° F. and 212° F.
28. The system of claim 7 , wherein the plurality of on-floor cooling units are coupled to the cooling water source in parallel such that the cooling water source is operable to provide cooling water to each of the on-floor cooling units simultaneously.
29. The system of claim 7 , wherein each on-floor cooling unit comprises a corresponding proportioning control valve configured to control a flow of cooling water through the on-floor cooling unit.
30. The system of claim 29 , further comprising:
a controller in communication with the proportional control valve of each on-floor cooling unit and configured to operate the control valves individually in response to signals received from one or more sensors.
31. The system of claim 30 , wherein at least one of the one or more sensors is configured to measure a leaving air temperature of an on-floor cooling unit.
32. The system of claim 30 , wherein at least one of the one or more sensors is configured to measure the temperature outside the data center.
33. The system of claim 7 , wherein the temperature of cooling water provided to at least one of the on-floor cooling units by the cooling water source is sufficient to inhibit air within the data center from condensing.
34. The system of claim 7 , wherein the temperature of cooling water provided to at least one of the on-floor cooling units is about 68° F.
35. The system of claim 7 , wherein the cooling water source comprises a cooling water circuit and a condenser circuit, the condenser circuit being configured to remove heat from the cooling water circuit.
36. The system of claim 35 , wherein the cooling water circuit comprises a closed-loop circuit.
37. The system of claim 35 , wherein the cooling water circuit and the condenser circuit are arranged to form an indirect water-side economizer.