Group III-nitride semiconductor thin film, method for fabricating the same, and group III-nitride semiconductor light emitting device
View Patent ↗Disclosed herein is a high-quality group III-nitride semiconductor thin film and group III-nitride semiconductor light emitting device using the same. To obtain the group III-nitride semiconductor thin film, an AlInN buffer layer is formed on a (1-102)-plane (so called r-plane) sapphire substrate by use of a MOCVD apparatus under atmospheric pressure while controlling a temperature of the substrate within a range from 850 to 950 degrees Celsius, and then, GaN-based compound, such as GaN, AlGaN or the like, is epitaxially grown on the buffer layer at a high temperature. The group III-nitride semiconductor light emitting device is fabricated by using the group III-nitride semiconductor thin film as a base layer.
1. A method for fabricating a group III-nitride semiconductor thin film comprising:
forming an intermediate layer on a (1-102)-plane sapphire substrate by stacking two or more group III-nitride layers one above another, each group III-nitride layer formed by nitriding a group III-metal atomic layer; and
growing a group III-nitride epitaxial layer on the intermediate layer,
wherein the group III-nitride layers include sequentially stacked first and second group III-nitride layers, the group III-metal atomic layers of which are made of different metals selected from the group consisting of Ga, Al, and In.
2. The method according to claim 1 , further comprising forming an AlInN buffer layer on a (1-102)-plane sapphire substrate to a first temperature before forming an intermediate layer, wherein the step of forming an intermediate layer comprises forming an intermediate layer on the buffer layer while controlling the sapphire substrate to a second temperature higher than the first temperature.
3. The method according to claim 2 , wherein the first temperature is in a range from 850 degrees Celsius to 950 degrees Celsius.
4. The method according to claim 2 , wherein the formation of the buffer layer and the growth of the group III-nitride epitaxial layer are performed at atmospheric pressure.
5. The method according to claim 1 , wherein the group III-nitride epitaxial layer is made of GaN.
6. The method according to claim 1 , wherein the group III-nitride epitaxial layer is made of AlGaN.
7. The method according to claim 1 , wherein the group III-nitride layers further include a third group III-nitride layer and the group III-metal atomic layer of the third group III-nitride layer is made of different metal from the first and second multi-level layers.