SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME

1 . A shielded electronic component comprising:

a wiring board;

a semiconductor integrated circuit device mounted on a main surface of the wiring board;

a sealant which seals the whole of an upper surface of the wiring board; and

a metal plating film formed on an upper surface of the sealant, wherein

the metal plating film is formed on a pretreatment layer formed only on the upper surface of the sealant with using high-pressure CO 2 in a state of protecting a back surface of the wiring board, and electrically connected with an end portion of a ground wiring layer on a side surface of the wiring board or a ground connection through-hole connected to the end portion of the ground wiring layer.

2 . The shielded electronic component according to claim 1 , wherein

the metal plating film is formed with mixing high-pressure CO 2 and a plating solution.

3 . The shielded electronic component according to claim 1 , wherein

the pretreatment layer contains palladium.

4 . The shielded electronic component according to claim 1 , wherein

the metal plating film is formed of a copper plating film or a nickel plating film.

5 . A method of manufacturing a shielded electronic component comprising the steps of:

mounting a semiconductor integrated circuit device configuring the shielded electronic component on a board for forming a plurality of the shielded electronic components;

forming a sealant on the whole of an upper surface of the board;

performing half-cut dicing on the board at a cutting portion of the individual shielded electronic component until reaching a ground wiring layer of the board or a ground connection through-hole connected with the ground wiring layer;

attaching back surfaces of two of the half-cut diced boards to each other and fixing end portions of the two boards by an adhesive;

forming a pretreatment layer on an upper surface of the sealant with using high-pressure CO 2 ;

forming a metal plating film on the pretreatment layer to be electrically connected with the ground wiring layer of the board or the ground connection through-hole connected with the ground wiring layer;

cutting off the adhering portion by the adhesive; and

performing full-cut dicing on the half-cut diced portion to cut out the individual shielded electronic component.

6 . A method of manufacturing a shielded electronic component comprising the steps of:

mounting a semiconductor integrated circuit device configuring the shielded electronic component on a board for forming a plurality of the shielded electronic components;

forming a sealant on the whole of an upper surface of the board;

performing half-cut dicing on the board at a cutting portion of the individual shielded electronic component until reaching a ground wiring layer of the board or a ground connection through-hole connected with the ground wiring layer;

applying a protective film on a back surface of the half-cut diced board;

fixing end portions of the board and the protective film by an adhesive;

forming a pretreatment layer on an upper surface of the sealant with using high-pressure CO 2 ;

forming a metal plating film on the pretreatment layer to be electrically connected with the ground wiring layer of the board or the ground connection through-hole connected with the ground wiring layer;

cutting off the adhering portion by the adhesive and exfoliating the protective film; and

performing full-cut dicing on the half-cut diced portion to cut out the individual shielded electronic component.