Semiconductor memory
View Patent ↗Manufacturing processes for phase change memory have suffered from the problem of chalcogenide material being susceptible to delamination, since this material exhibits low adhesion to high melting point metals and silicon oxide films. Furthermore, chalcogenide material has low thermal stability and hence tends to sublime during the manufacturing process of phase change memory. According to the present invention, conductive or insulative adhesive layers are formed over and under the chalcogenide material layer to enhance its delamination strength. Further, a protective film made up of a nitride film is formed on the sidewalls of the chalcogenide material layer to prevent sublimation of the chalcogenide material layer.
1. A semiconductor device comprising:
a semiconductor substrate;
a select transistor provided on a principal surface of the semiconductor substrate;
an interlayer insulating film provided over the select transistor;
a plug disposed in an opening in the interlayer insulating film, the plug being electrically connected to the select transistor;
an insulative adhesive layer provided on the interlayer insulating film, a material of the insulative adhesive layer being different from a material of the interlayer insulating film;
a first conductive adhesive layer provided on and in contact with an upper surface of the plug in a self-aligned manner, a sidewall of the first conductive adhesive layer being arranged at the same position on the upper surface of the plug as a sidewall of the plug, a material of the first conductive adhesive layer being different from a material of the plug; and
a phase change material layer provided on both of the insulative adhesive layer and the first conductive adhesive layer.
2. The semiconductor device according to claim 1 ,
wherein a thickness of the insulative adhesive layer is no more than 5 nm, and
wherein a thickness of the first conductive adhesive layer is no more than 5 nm.
3. The semiconductor device according to claim 1 ,
wherein a thickness of the insulative adhesive layer is no more than 2 nm, and
wherein a thickness of the first conductive adhesive layer is no more than 2 nm.
4. The semiconductor device according to claim 1 ,
wherein the insulative adhesive layer and the first conductive adhesive layer contain one or more elements in common.
5. The semiconductor device according to claim 4 ,
wherein the one or more common elements have a lower free energy of oxide formation than silicon.
6. The semiconductor device according to claim 4 ,
wherein the one or more common elements are one or more types of elements selected from the group consisting of Ti, Zr, Hf, and Al.
7. The semiconductor device according to claim 1 , further comprising:
a second conductive adhesive layer provided on the phase change material layer; and
an upper electrode provided on the second conductive adhesive layer.
8. The semiconductor device according to claim 7 ,
wherein an area of the first conductive adhesive layer is smaller than an area of the second conductive adhesive layer.
9. The semiconductor device according to claim 1 ,
wherein the phase change material layer can change between a crystalline state and an amorphous state so as to store data therein.
10. The semiconductor device according to claim 1 ,
wherein the first conductive adhesive layer is disposed between portions of the insulative adhesive layer in plan view.
11. The semiconductor device according to claim 1 ,
wherein the first conductive adhesive layer is interposed between a bottom surface of the phase change material layer and a top surface of the plug.
12. The semiconductor device according to claim 11 ,
wherein the insulative adhesive layer is interposed between the bottom surface of the phase change material layer and a top surface of the interlayer insulating film.
13. The semiconductor device according to claim 12 ,
wherein the top surfaces of the plug and the interlayer insulating film are substantially co-planar.
14. The semiconductor device according to claim 1 ,
wherein the interlayer insulating film is an oxide film and the plug is a metal, and
wherein the first conductive adhesive layer is formed on the plug in a self-aligned manner by depositing a metal layer on the entire upper surfaces of the interlayer insulating film and the plug, and heat treating the layers to form a conductive metal alloy only on the plug and an oxide film only on the interlayer insulating film.
15. The semiconductor device according to claim 14 ,
wherein the interlayer insulating film is a silicon oxide film, the plug is tungsten and the metal layer is a titanium layer, and
wherein a conductive titanium-tungsten alloy is formed only on the plug, and a titanium oxide film is formed only on the interlayer insulating film.