Silicone based reflective underfill and thermal coupler
View Patent ↗In one embodiment, a flip chip LED is formed with a high density of gold posts extending from a bottom surface of its n-layer and p-layer. The gold posts are bonded to submount electrodes. An underfill material is then molded to fill the voids between the bottom of the LED and the submount. The underfill comprises a silicone molding compound base and about 70-80%, by weight, alumina (or other suitable material). Alumina has a thermal conductance that is about 25 times better than that of the typical silicone underfill, which is mostly silica. The alumina is a white powder. The underfill may also contain about 5-10%, by weight, TiO 2 to increase the reflectivity. LED light is reflected upward by the reflective underfill, and the underfill efficiently conducts heat to the submount. The underfill also randomizes the light scattering, improving light extraction. The distributed gold posts and underfill support the LED layers during a growth substrate lift-off process.
1. A light emitting device comprising:
a light emitting diode (LED) die, the LED die having a bottom surface;
a submount on which the LED die is mounted, there being a gap between the LED die and the submount;
the LED die having a plurality of metal posts electrically connected to the bottom surface, there being substantially transparent areas between the metal posts along a bottom surface of the LED die so that light emitted downward by the LED die passes between the metal posts; and
a substantially reflective underfill material filling voids between the bottom surface of the LED die and the submount, the underfill material comprising silicone and a reflective powder having a thermal conductivity greater than 20 W/m/K, the underfill material reflecting light from the LED die generally upward and conducting heat between the LED die and the submount
wherein the underfill material further comprises silicone infused with TiO2, wherein the TiO2 comprises more than about 5%, by weight, of the underfill material.
2. The device of claim 1 , wherein the reflective underfill material diffusively reflects light from the LED die.
3. The device of claim 1 , wherein the underfill material comprises a silicone molding compound having a glass transition temperature below room temperature.
4. A light emitting device comprising:
a light emitting diode (LED) die, the LED die having a bottom surface;
a submount on which the LED die is mounted, there being a gap between the LED die and the submount;
the LED die having a plurality of metal posts electrically connected to the bottom surface, there being substantially transparent areas between the metal posts along a bottom surface of the LED die so that light emitted downward by the LED die passes between the metal posts; and
a substantially reflective underfill material filling voids between the bottom surface of the LED die and the submount, the underfill material comprising silicone and a reflective powder having a thermal conductivity greater than 20 W/m/K, the underfill material reflecting light from the LED die generally upward and conducting heat between the LED die and the submount
wherein the reflective powder comprises alumina being at least 70%, by weight, of the underfill material.
5. The device of claim 4 , wherein the reflective underfill material diffusively reflects light from the LED die.
6. The device of claim 4 , wherein the underfill material comprises a silicone molding compound having a glass transition temperature below room temperature.
7. A light emitting device comprising:
a light emitting diode (LED) die, the LED die having a bottom surface;
a submount on which the LED die is mounted, there being a gap between the LED die and the submount;
the LED die having a plurality of metal posts electrically connected to the bottom surface, there being substantially transparent areas between the metal posts along a bottom surface of the LED die so that light emitted downward by the LED die passes between the metal posts; and
a substantially reflective underfill material filling voids between the bottom surface of the LED die and the submount, the underfill material comprising silicone and a reflective powder having a thermal conductivity greater than 20 W/m/K, the underfill material reflecting light from the LED die generally upward and conducting heat between the LED die and the submount
wherein the underfill material has a reflectivity of at least 90%, for visible light, and a thermal conductivity of at least about 20 W/m/K.
8. The device of claim 7 wherein the LED die is a flip chip.
9. The device of claim 7 wherein the metal posts are spaced less than 50 microns apart.
10. The device of claim 7 wherein the LED die has a p-type layer facing the submount, the device further comprising a non-semiconductor substantially transparent conductive layer over the p-type layer and between the p-type layer and the metal posts.
11. The device of claim 7 wherein the LED die has a p-type layer facing the submount, wherein the metal posts are gold posts plated over the p-type layer.
12. The device of claim 7 wherein the LED die has a p-type layer facing the submount, the device further comprising:
a non-semiconductor substantially transparent conductive layer over the p-type layer;
metal pads deposited over the substantially transparent conductive layer; and
wherein the metal posts comprise gold posts plated over the metal pads.
13. The device of claim 7 wherein the metal posts are between 3-7 microns long.
14. The device of claim 7 further comprising one set of metal posts electrically contacting a p-type layer in the LED die and another set of metal posts electrically contacting an n-type layer in the LED die.
15. The device of claim 7 wherein the metal posts have a thickness between 10-20 microns and are spaced less than 50 microns apart.
16. The device of claim 7 wherein the reflective underfill material diffusively reflects light from the LED die.
17. The device of claim 7 wherein a growth substrate for the LED die has been removed.
18. The device of claim 7 , wherein the underfill material comprises a silicone molding compound having a glass transition temperature below room temperature.
19. The device of claim 7 , wherein the underfill material comprises a silicone molding compound having a glass transition temperature below room temperature.