IP Library Granted Patent US 8,253,037
Granted Patent B2
US 8,253,037 · App. 12/616,060 · Granted Aug 28, 2012

Electromagnetic shielding configuration

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Quick Facts
Patent No.
US 8,253,037
App. No.
12/616,060
Granted
Aug 28, 2012
Kind
B2
Abstract

An electromagnetic shielding configuration comprising a first electrically conductive wall having a first surface and a second electrically conductive wall having a second surface. The first surface is oppositely disposed from the second surface, wherein interfacing of the first conductive wall and the second conductive wall forms an enclosure wall. The first surface comprises at least one stepped edge forming a plurality of surfaces of unequal lateral displacement, and a corrugated surface on at least one of the plurality of surfaces, the corrugated surface formed by a series of apices extending radially from the first surface. The second surface is substantially a conjugate of the first surface.

Claims (19)

1. An electromagnetic shielding configuration comprising:

a first electrically conductive wall having a first edge; and

a second electrically conductive wall having a second edge that is substantially a conjugate of the first edge, the first edge being oppositely disposed from the second edge and the interfacing of the first edge and the second edge forming an enclosure wall,

wherein the first edge comprises:

a first raised surface;

a second raised surface substantially parallel to the first raised surface;

a middle corrugated surface positioned between and laterally displaced from the first and second raised surfaces and comprising a series of apices extending from a base of the corrugated surface;

a first stepped surface substantially perpendicular and adjacent to both the first raised surface and the corrugated surface; and

a second stepped surface adjacent and perpendicular to both the corrugated surface and the second raised surface.

2. An electromagnetic shielding configuration according to claim 1 , wherein the first raised surface is not laterally displaced from the second raised surface.

3. An electromagnetic shielding configuration according to claim 1 , wherein each of the apices is angled at a non-perpendicular angle relative to the enclosure.

4. An electromagnetic shielding configuration according to claim 1 , wherein the corrugated surface is a serrated edge surface.

5. An electromagnetic shielding configuration according to claim 4 , wherein the interfacing of the first edge and the second edge forming the enclosure wall defines openings.

6. An electromagnetic shielding configuration according to claim 5 , wherein the openings are less than about 1/20th of the ratio of a speed of light in air to the data rate of a device implementing the electromagnetic shielding configuration.

7. An electromagnetic shielding configuration according to claim 1 , wherein the corrugated surface is an interlocking rectangular surface.

8. An electromagnetic shielding configuration according to claim 1 , wherein the corrugated surface comprises of a series of semicircular arcs.

9. An electromagnetic shielding configuration according to claim 1 , wherein the middle corrugated surface includes a plurality of ridges that extend in parallel to the surface of the enclosure wall.

10. An electromagnetic shielding configuration according to claim 1 , wherein the first wall is electrically grounded.

11. An electromagnetic shielding configuration according to claim 1 , wherein the first wall is shorted to the second wall.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2010
From: TEO, TAT MING; LIU, JINXIANG
To: FINISAR CORPORATION
Reel/Frame 023893/0623 →