IP Library Granted Patent US 8,287,192
Granted Patent B2
US 8,287,192 · App. 12/618,504 · Granted Oct 16, 2012

Optical network unit transceiver

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Quick Facts
Patent No.
US 8,287,192
App. No.
12/618,504
Granted
Oct 16, 2012
Kind
B2
Abstract

In one example embodiment, a pluggable ONU transceiver module comprises a top shell, a bottom shell configured to mate with the top shell to form a cavity, and a PCB disposed within the cavity. A plurality of pins are coupled to the PCB and are configured to be inserted into a protruding socket of a host device through the bottom shell. The protruding socket is mounted on a PCB of the host device. The pluggable ONU transceiver module further comprises one or more guiding features integrated with the bottom shell and configured to ensure that the pins are inserted correctly into the protruding socket, and means for positioning the top shell at a predetermined height above the PCB of the host device to allow coupling of the top shell to a heatsink of the host device.

Claims (13)

1. A pluggable optical network unit transceiver module comprising:

a top shell;

a bottom shell configured to mate with the top shell to form a cavity;

a printed circuit board disposed within the cavity;

a plurality of pins coupled to the printed circuit board and configured to be inserted into a protruding socket mounted on a printed circuit board of a host device through the bottom shell;

one or more guiding features integrated with the bottom shell and configured to ensure that the plurality of pins are inserted correctly into the protruding socket; and

means for positioning the top shell at a predetermined height above the printed circuit board of the host device to allow coupling of the top shell to a heatsink of the host device.

2. The module of claim 1 , wherein the one or more guiding features comprise an opening formed in the bottom shell, the opening having a shape that substantially corresponds to a shape of the protruding socket, the plurality of pins being positioned within the cavity such that when the opening is aligned with the protruding socket, each of the plurality of pins is aligned with a corresponding hole of the protruding socket and received therein when the protruding socket is inserted through the opening.

3. The module of claim 2 , further comprising an electromagnetic interference shield disposed in the cavity between the printed circuit board of the module and the bottom shell.

4. The module of claim 1 , wherein the one or more guiding features include two tabs formed in the bottom shell, a distance between the two tabs being substantially equal to a length of the protruding socket to allow the protruding socket to be received between the two tabs.

5. The module of claim 1 , wherein the means for positioning the top shell at a predetermined height above the printed circuit board of the host device comprises the bottom shell.

6. The module of claim 1 , wherein the means for positioning the top shell at a predetermined height above the printed circuit board of the host device comprises the top shell.

7. The module of claim 1 , wherein the means for positioning the top shell at a predetermined height above the printed circuit board of the host device comprises an insert configured to be coupled to the top shell.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2010
From: TEO, TAT MING
To: FINISAR CORPORATION
Reel/Frame 023893/0722 →