Method and system for controlling resistivity in ingots made of compensated feedstock silicon
View Patent ↗Techniques for controlling resistivity in the formation of a silicon ingot from compensated feedstock silicon material prepares a compensated, upgraded metallurgical silicon feedstock for being melted to form a silicon melt. The compensated, upgraded metallurgical silicon feedstock provides semiconductor predominantly of a single type (p-type or n-type) for which the process assesses the concentrations of boron and phosphorus and adds a predetermined amount of boron, phosphorus, aluminum and/or gallium. The process further melts the silicon feedstock with the boron, phosphorus, aluminum and/or gallium to form a molten silicon solution from which to perform directional solidification and maintains the homogeneity of the resistivity of the silicon throughout the ingot. A balanced amount of phosphorus can be optionally added to the aluminum and/or gallium. Resistivity may also be measured repeatedly during ingot formation, and additional dopant may be added in response, either repeatedly or continuously.
1. A method for controlling resistivity in the formation of a silicon ingot, comprising the steps of:
preparing a compensated, upgraded metallurgical silicon feedstock for being melted to form a silicon melt, said compensated, upgraded metallurgical silicon feedstock comprising a predominantly p-type semiconductor;
assessing quantitatively the relative concentrations of boron and phosphorous in said compensated, upgraded metallurgical silicon feedstock;
adding to said compensated, upgraded metallurgical silicon feedstock a greater-than-zero quantity of phosphorous if an initial resistivity of the upgraded metallurgical silicon feedstock is below a threshold resistivity;
adding to said compensated, upgraded metallurgical silicon feedstock a greater-than-zero quantity of gallium, wherein said quantitatively assessed relative concentrations of boron and phosphorous determine said greater-than-zero quantity of gallium;
melting said upgraded metallurgical silicon feedstock and said greater-than-zero quantity of gallium to form a molten silicon solution including said greater-than-zero quantity of gallium; and
performing a directional solidification of said molten silicon solution for forming a silicon ingot and, by virtue of said adding said greater-than-zero quantity of suppressing the transition of said silicon ingot to n-type material and maintaining the resistivity of said silicon ingot within an operational range to approximately 95% solidification by virtue of reducing the effect of differing boron and phosphorous segregation coefficients.
2. The method of claim 1 , further including performing a resistivity measurement to determine the greater-than-zero quantity of gallium, wherein performing the resistivity measurement includes:
inserting a rod into said molten silicon solution;
allowing a portion of said molten silicon solution to solidify on said rod; and
measuring the resistivity of said solidified portion of said molten silicon solution.
3. The method of claim 2 , wherein said rod comprises quartz.
4. The method of claim 1 , wherein said step of performing resistivity measurements comprises contactless measuring.
5. The method of claim 1 , wherein the gallium is in a substantially pure elemental form.
6. The method of claim 1 , wherein the gallium is in a doped-silicon form.
7. A method for controlling resistivity in the formation of a silicon ingot, comprising the steps of:
preparing a compensated, upgraded metallurgical silicon feedstock for being melted to form a silicon melt, said compensated, upgraded metallurgical silicon feedstock comprising a predominantly n-type semiconductor;
assessing quantitatively the relative concentrations of boron and phosphorous in said compensated, upgraded metallurgical silicon feedstock;
adding to said compensated, upgraded metallurgical silicon feedstock a greater-than-zero quantity of phosphorous if an initial resistivity of the upgraded metallurgical silicon feedstock is below a threshold resistivity;
adding to said compensated, upgraded metallurgical silicon feedstock a greater-than-zero quantity of gallium wherein said quantitatively assessed relative concentrations of boron and phosphorous determine said greater-than-zero quantity of gallium;
melting said upgraded metallurgical silicon feedstock and said greater-than-zero quantity of gallium to form a molten silicon solution including said greater-than-zero quantity of gallium; and
performing a directional solidification of said molten silicon solution for forming a silicon ingot and, by virtue of said adding said greater-than-zero quantity of gallium, maintaining the resistivity of said silicon ingot within a predetermined range to approximately 95% solidification by virtue of reducing the effect of differing boron and phosphorous segregation coefficients.
8. The method of claim 7 , further including performing a resistivity measurement to determine the greater-than-zero quantity of gallium, wherein performing the resistivity measurement includes:
inserting a rod into said molten silicon solution;
allowing a portion of said molten silicon solution to solidify on said rod; and
measuring the resistivity of said solidified portion of said molten silicon solution.
9. The method of claim 8 , wherein said rod comprises quartz.
10. The method of claim 7 , wherein said step of performing resistivity measurements comprises contactless measuring.
11. The method of claim 7 , wherein the gallium is in a substantially pure elemental form.
12. The method of claim 7 , wherein the gallium is in a doped-silicon form.