IP Library Granted Patent US 8,134,170
Granted Patent B2
US 8,134,170 · App. 12/620,260 · Granted Mar 13, 2012

Nitride semiconductor light emitting device and method of manufacturing the same

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Quick Facts
Patent No.
US 8,134,170
App. No.
12/620,260
Granted
Mar 13, 2012
Kind
B2
Abstract

A nitride semiconductor light emitting device, and a method of manufacturing the same are disclosed. The nitride semiconductor light emitting device includes a substrate, an n-type nitride semiconductor layer disposed on the substrate and including a plurality of V-shaped pits in a top surface thereof, an active layer disposed on the n-type nitride semiconductor layer and including depressions conforming to the shape of the plurality of V-shaped pits, and a p-type nitride semiconductor layer disposed on the active layer and including a plurality of protrusions on a top surface thereof. Since the plurality of V-shaped pits are formed in the top surface of the n-type nitride semiconductor layer, the protrusions can be formed on the p-type nitride semiconductor layer as an in-situ process. Accordingly, the resistance to ESD, and light extraction efficiency are enhanced.

Claims (12)

1. A nitride semiconductor light emitting device comprising:

a substrate;

an n-type nitride semiconductor layer disposed on the substrate and including a plurality of V-shaped pits in a top surface thereof;

an active layer disposed on the n-type nitride semiconductor layer and including depressions conforming to the shape of the plurality of V-shaped pits; and

a p-type nitride semiconductor layer disposed on the active layer and including a plurality of protrusions on a top surface thereof,

wherein the plurality of protrusions correspond to the plurality of V-shaped pits to overlap in a vertical direction, respectively.

2. The nitride semiconductor light emitting device of claim 1 , wherein the plurality of protrusions have widths greater than the plurality of V-shaped pits.

3. The nitride semiconductor light emitting device of claim 1 , further comprising an n-type nitride-based superlattice layer disposed between the n-type nitride semiconductor layer and the active layer and including depressions conforming to the shape of the plurality of V-shaped pits.

4. The nitride semiconductor light emitting device of claim 1 , further comprising a p-type nitride-based superlattice layer disposed between the active layer and the p-type nitride semiconductor layer and including depressions conforming to the shape of the plurality of V-shaped pits.

5. The nitride semiconductor light emitting device of claim 1 , further comprising:

an n-type nitride-based superlattice layer disposed between the n-type nitride semiconductor layer and the active layer and including depressions conforming to the shape of the plurality of V-shaped pits; and

a p-type nitride-based superlattice layer disposed between the active layer and the p-type nitride semiconductor layer and including depressions conforming to the shape of the plurality of V-shaped pits.

Assignments (2)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2012
From: OH, JEONG TAK; KIM, YONG CHUN
To: SAMSUNG LED CO., LTD.
Reel/Frame 027486/0312 →