IP Library Granted Patent US 8,174,045
Granted Patent B2
US 8,174,045 · App. 12/621,572 · Granted May 8, 2012

Glass for covering optical element, glass-covered light-emitting element and glass-covered light-emitting device

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Quick Facts
Patent No.
US 8,174,045
App. No.
12/621,572
Granted
May 8, 2012
Kind
B2
Abstract

A glass-covered light-emitting element and a glass-covered light-emitting device are provided, which are covered with a glass having a low glass transition point and a thermal expansion coefficient close to that of the light-emitting element. The glass-covered light-emitting element includes a semiconductor light-emitting element having a principal surface, and a P 2 O 5 —ZnO—SnO type glass covering the principal surface of the semiconductor light-emitting element, and the glass consists essentially of, as represented by mol % based on the following oxides, from 20 to 45% of P 2 O 5 , from 20 to 50% of ZnO and from 20 to 40% of SnO, and the glass has a glass transition point of at least 290° C. and at most 450° C., and a thermal expansion coefficient of at most 105×10 −7 /° C.

Claims (35)

1. A glass for covering an optical element, consisting essentially of as represented by mol % based on the following oxides:

from 27 to 35% of P 2 O 5 ,

from 25 to 45% of ZnO,

from 25 to 40% of SnO, and

from 0.1 to 10% of at least one member selected from the group consisting of B 2 O 3 and CaO,

wherein the difference between the peak temperature of crystallization and the glass transition temperature of the glass is at least 150° C.

2. The glass for covering an optical element according to claim 1 , wherein the percentage of Sn 2+ based on the total amount of Sn atoms is at least 90%.

3. The glass for covering an optical element, according to claim 1 , which contains, as represented by mol % based on the following oxides:

from 0 to 3% of Al 2 O 3 ,

from 0 to 3% of In 2 O 3 , and

from 0 to 3% of La 2 O 3 ,

wherein the content of at least one member selected from the group consisting of Al 2 O 3 , In 2 O 3 and La 2 O 3 is from 0.1 to 7%.

4. The glass for covering an optical element according to claim 1 , which has an expansion coefficient of from 70×10 −7 to 100×10 −7 /° C.

5. The glass for covering an optical element according to claim 1 , which has a glass transition temperature of at most 400° C.

6. The glass for covering an optical element according to claim 1 , wherein the difference between the peak temperature of crystallization and the glass transition temperature of the glass is at least 180° C.

7. A glass-covered light-emitting element, comprising a semiconductor light-emitting element having a principal surface, and the glass of claim 1 covering the principal surface of the semiconductor light-emitting element.

8. The glass-covered light-emitting element according to claim 7 , wherein the glass has a glass transition point of at most 450° C.

9. The glass-covered light-emitting element according to claim 8 , wherein the glass consists essentially of, as represented by mol % based on the following oxides:

from 20 to 45% of P 2 O 5 ,

from 20 to 50% of ZnO, and

from 20 to 40% of SnO,

and the glass has a glass transition point of at least 290° C. and a thermal expansion coefficient of at most 105×10 −7 /° C.

10. The glass-covered light-emitting element according to claim 9 , wherein the content of SnO is from 20 to 35%.

11. The glass-covered light-emitting element according to claim 7 , wherein the weight reduction of the glass in its water-resistance test is at most 50%.

12. A glass-covered light-emitting device comprising:

a substrate having a principal surface;

a semiconductor light-emitting element having a principal surface and a rear surface and provided on the principal surface of the substrate so that the rear surface of the semiconductor light-emitting element faces the principal surface of the substrate; and

the glass of claim 1 covering the principal surface of the semiconductor light-emitting element.

13. A glass-covered light-emitting element comprising:

a semiconductor light-emitting element having a principal surface; and

a glass covering the principal surface of the semiconductor light-emitting element and consisting essentially of, as represented by mol % based on the following oxides: from 27 to 35% of P 2 O 5 , from 25 to 45% of ZnO, from 25 to 40% of SnO, and from 0.1 to 10% of at least one member selected from the group consisting of B 2 O 3 and CaO, wherein the difference between the peak temperature of crystallization and the glass transition temperature of the glass is at least 150° C.

14. A glass-covered light-emitting device comprising:

a substrate having a principal surface;

a semiconductor light-emitting element having a principal surface and a rear surface and provided on the principal surface of the substrate so that the rear surface of the semiconductor light-emitting element faces the principal surface of the substrate; and

a glass covering the principal surface of the semiconductor light-emitting element and consisting essentially of, as represented by mol % based on the following oxides: from 27 to 35% of P 2 O 5 , from 25 to 45% of ZnO, from 25 to 40% of SnO, and from 0.1 to 10% of at least one member selected from the group consisting of B 2 O 3 and CaO, wherein the difference between the peak temperature of crystallization and the glass transition temperature of the glass is at least 150° C.

Assignments (3)
CHANGE OF NAME Recorded Aug 7, 2018
From: ASAHI GLASS COMPANY, LIMITED
To: AGC INC.
Reel/Frame 046730/0786 →
CORPORATE ADDRESS CHANGE Recorded Nov 9, 2011
From: ASAHI GLASS COMPANY, LIMITED
To: ASAHI GLASS COMPANY, LIMITED
Reel/Frame 027197/0541 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2009
From: MATSUMOTO, SYUJI; OSAKI, YASUKO; NAKAMURA, NOBUHIRO
To: ASAHI GLASS COMPANY, LIMITED
Reel/Frame 023543/0478 →