EMI/RFI shielding resin composite material and molded product made using the same
Disclosed is an electromagnetic wave EMI/RFI shielding resin composite material that includes a thermoplastic polymer resin, an electrically conductive filler having a polyhedral shape or being capable of forming a polyhedral shape, and a low-melting point metal, and a molded product made using the EMI/RFI shielding resin composite material.
1. An electromagnetic wave interference (EMI)/radio frequency interference (RFI) shielding resin composite material, comprising:
(A) a thermoplastic polymer resin;
(B) about 20 to about 69 volume % of an electrically conductive filler having a polyhedral shape or being capable of forming a polyhedral shape;
(C) a low-melting point metal including a primary component comprising tin, bismuth, lead, or a combination thereof, and a secondary component comprising copper, aluminum, nickel, silver, germanium, indium, zinc, or a combination thereof; and
(D) a glass fiber filler.
2. The EMI/RFI shielding resin composite material of claim 1 , wherein the EMI/RFI shielding resin composite material comprises:
about 30 to about 85 volume % of the thermoplastic polymer resin (A);
about 1 to about 10 volume % of the low-melting point metal (C).
3. The EMI/RFI shielding resin composite material of claim 1 , comprising the glass fiber filler (D) in an amount of about 50 parts by weight or less based on about 100 parts by weight of the EMI/RFI shielding resin composite material.
4. The EMI/RFI shielding resin composite material of claim 1 , wherein the thermoplastic polymer resin (A) comprises a polyamide, a polyalkylene terephthalate, a polyacetal, a polycarbonate, a polyimide, a polyphenylene oxide, a polysulfone, a polyphenylene sulfide, a polyamide imide, a polyether sulfone, a liquid crystal polymer, a polyetherketone, a polyetherimide, a polyolefin, acrylonitrile-butadiene-styrene, a polystyrene, a syndiotactic polystyrene, or a combination or blend thereof.
5. The EMI/RFI shielding resin composite material of claim 1 , wherein the electrically conductive filler having a polyhedral shape or being capable of forming a polyhedral shape (B) comprises a needle-shaped electrically conductive filler having a polyhedral interior, a sheet-shaped electrically conductive filler having a polyhedral interior, a globular electrically conductive filler having a polyhedral interior, or a combination thereof.
6. The EMI/RFI shielding resin composite material of claim 5 , wherein the needle-shaped electrically conductive filler having a polyhedral interior is a metal filler fabricated in a needle shape by pressing and cutting a dendrite metal filler fabricated through an electrolysis process or a porous metal filler fabricated through a thermal process, or a needle-shaped metal filler fabricated by polishing a metal lump;
the sheet-shaped electrically conductive filler having a polyhedral interior is a metal filler fabricated in a sheet shape by pressing a dendrite metal filler fabricated through an electrolysis process or a porous metal filler fabricated through a thermal process, or a sheet-shaped metal filler fabricated through a pulverization process; and
the globular electrically conductive filler having a polyhedral interior is a globular metal filler fabricated through a melt injection process.
7. The EMI/RFI shielding resin composite material of claim 1 , wherein the electrically conductive filler (B) is broken down or pulverized by a shear stress applied during a process of making the EMI/RFI shielding resin composite material to thereby form a polyhedral shape.
8. The EMI/RFI shielding resin composite material of claim 7 , wherein the electrically conductive filler (B) has a shear strength of under about 300 MPa.
9. The EMI/RFI shielding resin composite material of claim 1 , wherein the electrically conductive filler (B) comprises aluminum, copper, magnesium, iron, nickel, molybdenum, zinc, silver, alloys thereof or a combination thereof.
10. The EMI/RFI shielding resin composite material of claim 1 , wherein the low-melting point metal (C) is a solid solution including two or more kinds of metal elements.
11. The EMI/RFI shielding resin composite material of claim 1 , wherein the low-melting point metal (C) has a solidus temperature that is lower than a temperature of a process of making the EMI/RFI shielding resin composite material.
12. A molded product made using the EMI/RFI shielding resin composite material according to claim 1 .
13. An electromagnetic wave interference (EMI)/radio frequency interference (RFI) shielding resin composite material, comprising:
(A) a thermoplastic polymer resin;
(B) about 20 to about 69 volume % of an electrically conductive filler having a polyhedral shape or being capable of forming a polyhedral shape;
(C) a low-melting point metal having a solidus temperature that is lower than a temperature of a process of making the EMI/RFI shielding resin composite material; and
(D) a glass fiber filler.