Electronic apparatus
View Patent ↗An electronic apparatus including: a body; a circuit board housed in the body; a heating body mounted on the circuit board; a heat pipe having: an end portion, a heat emitting portion located on an opposite side to the end portion, and a heat receiving portion located between the end portion and the heat emitting portion and thermally connected to the heating body; a bonding member disposed between the heating body and the heat receiving portion and that bonds the heating body and the heat receiving portion; and an extension that extends toward the circuit board.
1. An electronic apparatus comprising:
a body;
a circuit board housed in the body;
a heating body mounted on the circuit board;
a heat pipe having: an end portion including an extension that extends toward the circuit board, a heat emitting portion located on an opposite side to the end portion, and a heat receiving portion located between the end portion and the heat emitting portion and thermally connected to the heating body; and
a bonding member disposed between the heating body and the heat receiving portion and that bonds the heating body and the heat receiving portion.
2. The electronic apparatus according to claim 1 , wherein the heat pipe has a flat shape in which a width in a direction along the circuit board is greater than a width in a direction perpendicular to the circuit board.
3. The electronic apparatus according to claim 2 , wherein the extension has a counter portion that is opposed to and separated from the circuit board.
4. The electronic apparatus according to claim 3 , wherein the extension is formed by bending a part of the end portion of the heat pipe toward the circuit board.
5. The electronic apparatus according to claim 4 , wherein the end portion of the heat pipe has a caulked portion formed by being caulked in the direction along the circuit board.
6. The electronic apparatus according to claim 5 , wherein the counter portion of the extension has a hardened portion that is increased in rigidity by bending a part of the caulked portion.
7. The electronic apparatus according to claim 6 , wherein the hardened portion is increased in rigidity by bending the caulked portion in a width direction.
8. The electronic apparatus according to claim 7 , wherein the hardened portion has a projection that projects from a part of a tip.
9. The electronic apparatus according to claim 6 , wherein the hardened portion is increased in rigidity by winding the caulked portion around a tip of the heat pipe.
10. The electronic apparatus according to claim 3 , wherein the circuit board has a rib disposed in a vicinity of the counter portion.