Polymer microfiller composites
View Patent ↗The instant invention generally provides polymer microfiller composite comprising a molecularly self-assembling material and a microfiller, and a process of making and an article comprising the polymer microfiller composite.
1. A polymer microfiller composite comprising a molecularly self-assembling (MSA) material and a microfiller dispersed in the MSA material, wherein the microfiller is in the form of a particle having an average size of 1.0 micrometer (μm) or larger or a fiber having an average diameter of 1.0 micrometer or larger, and the microfiller comprises a cellulosic material, the microfiller comprising from 1 weight percent (wt %) to 90 wt % of the polymer microfiller composite based on total weight of the polymer microfiller composite; and wherein MSA material comprises a repeat unit of Formula I:
at least one second repeat unit selected from the group consisting of Formula II and Formula III:
and an ester-urethane unit of Formula IV:
wherein:
R is at each occurrence, independently a C 2 -C 20 non-aromatic hydrocarbylene group, a C 2 -C 20 non-aromatic heterohydrocarbylene group, or a polyalkylene oxide group having a group molecular weight of from about 100 grams per mole to about 5000 grams per mole;
R 1 at each occurrence independently is a bond or a C 1 -C 20 non-aromatic hydrocarbylene group;
R 2 at each occurrence independently is a C 1 -C 20 non-aromatic hydrocarbylene group;
R N is —N(R 3 )—Ra—N(R 3 )—, where R 3 at each occurrence independently is H or a C 1 -C 6 alkylene and Ra is a C 2 -C 20 non-aromatic hydrocarbylene group, or R N is a C 2 -C 20 heterocycloalkyl group containing the two nitrogen atoms, wherein each nitrogen atom is bonded to a carbonyl group according to formula (III) above;
n is at least 1 and has a mean value less than 2; and
w represents the ester mol fraction of Formula I, and x, y and z represent the amide or urethane mole fractions of Formulas II, III, and IV, respectively, where w+x+y+z=1, and 0<w<1, and at least one of x and y is greater than zero but less than 1; wherein z is greater than zero and wherein when the MSA material is in a form of a melt, the polymer microfiller composite being characterized by a zero shear viscosity of less than 10,000,000 Pascal-seconds at from above T m up to about 40° C. above T m of the MSA material and wherein the MSA material has a number average molecular weight of less than 7,500 g/mol.
2. The polymer microfiller composite as in claim 1 , wherein the cellulosic material comprises a wood.
3. The polymer microfiller composite as in claim 1 , wherein the MSA material comprises self-assembling units comprising multiple hydrogen bonding arrays.
4. The polymer microfiller composite as in claim 1 , wherein the number average molecular weight (Mn) of the molecularly self-assembling material is between about 1000 grams per mole and about 5,000 grams per mole.
5. The polymer microfiller composite as in claim 1 , wherein the MSA material itself (i.e., without microfiller) is characterized by a melt viscosity of less than 100 pascal-seconds (Pa·sec.) at from above melting temperature (T m ) up to about 40 degrees Celsius (° C.) above T m .
6. The polymer microfiller composite as in claim 1 , wherein the MSA material itself is characterized by a melting temperature (T m ) greater than 60° C. or a glass transition temperature (T g ) greater than −80° C.
7. A process for making a polymer microfiller composite, the process comprising the step of: mixing a desired amount of a microfiller in either a melt comprising a MSA material or a solution comprising a solvent and the MSA material to produce the polymer microfiller composite of claim 1 .
8. An article comprising the polymer microfiller composite as in claim 1 .
9. The article as in claim 8 , wherein the article comprises a molded part, construction material, paper, tape, label, or automotive component.
10. The article as in claim 8 , wherein the article comprises a cosmetic, sound insulation, bather material, home furnishing, floor covering backing, coating substrate, laminating substrate, or electronic component.